Power supply unit for aerosol inhaler

ABSTRACT

A power supply unit for an aerosol inhaler includes: a power supply configured to supply power to a load that atomizes an aerosol source; a temperature sensor configured to detect a temperature of the power supply; a controller; and a circuit board. The circuit board includes: a first surface; a second surface; a power supply layer in which a power supply path is formed; and a ground layer. The power supply layer and the ground layer are provided between the first surface and the second surface. The temperature sensor is mounted on the second surface, and at least one of the power supply path and the ground path is not formed in a region which overlaps the temperature sensor as viewed from a first direction, the first direction being a direction in which the first surface and the second surface are opposed to each other.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority to Japanese Patent Applications No.2020-118745 filed on Jul. 9, 2020, No. 2020-118746 filed on Jul. 9,2020, and No. 2020-217704 filed on Dec. 25, 2020, the contents of whichare incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a power supply unit for an aerosolinhaler.

BACKGROUND ART

In related art, there has been known a power supply unit for an aerosolinhaler which includes a power supply capable of supplying power to aload for atomizing an aerosol source (for example, JP 2017-518733 T andJP 6647436 B).

When a temperature of the power supply becomes high, a service lifethereof becomes short while charging and discharging performance thereofdeteriorates, and thus it is desirable that the temperature of the powersupply is accurately detected in such a power supply unit for an aerosolinhaler.

However, in the related art, there is room for improvement from theviewpoint of accurately detecting a temperature of a power supply by atemperature sensor. For example, although a power supply unit for anaerosol inhaler of JP 2017-518733 T includes a temperature sensorconfigured to acquire an environmental temperature, no temperaturesensor is mounted on a circuit board to detect a temperature of a powersupply. Although a power supply unit for an aerosol inhaler of JP6647436 B includes a temperature sensor configured to detect atemperature of a power supply, accuracy of the temperature of the powersupply detected by the temperature sensor is not clear since how thetemperature sensor is mounted on a circuit board, such as a positionalrelationship between other elements mounted on the circuit board and thetemperature sensor, is not shown.

It is an object of the present invention to provides a power supply unitfor an aerosol inhaler capable of more accurately detecting atemperature of a power supply by a temperature sensor.

SUMMARY OF INVENTION

According to an aspect of the present invention, there is provided apower supply unit for an aerosol inhaler that includes: a power supplyconfigured to supply power to a load that atomizes an aerosol source; atemperature sensor configured to detect a temperature of the powersupply; a controller configured to control at least one of charging ofthe power supply and discharging to the load based on an output of thetemperature sensor; and a circuit board on which a plurality of elementsincluding the temperature sensor and the controller are mounted. Thecircuit board includes: a first surface; a second surface which is areverse surface from the first surface or is located on a side oppositefrom the first surface; a power supply layer in which a power supplypath configured to supply power to the plurality of elements is formed;and a ground layer in which a ground path configured to function as aground of the plurality of elements is formed. The power supply layerand the ground layer are provided between the first surface and thesecond surface. The temperature sensor is mounted on the second surface.At least one of the power supply path and the ground path is not formedin a region which overlaps the temperature sensor as viewed from a firstdirection, the first direction being a direction in which the firstsurface and the second surface are opposed to each other.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of an aerosol inhaler of an embodiment ofthe present invention.

FIG. 2 is an exploded perspective view of the aerosol inhaler shown inFIG. 1.

FIG. 3 is a cross-sectional view of the aerosol inhaler shown in FIG. 1.

FIG. 4 shows a circuit configuration of a power supply unit of theaerosol inhaler shown in FIG. 1.

FIG. 5 is a block diagram showing a configuration of an MCU of the powersupply unit of the aerosol inhaler shown in FIG. 1.

FIG. 6 is a table comparing specifications of a first DC/DC converterand a second DC/DC converter of the aerosol inhaler shown in FIG. 1.

FIG. 7 is a schematic view showing a main part of a circuitconfiguration of a first surface of a circuit board of the aerosolinhaler shown in FIG. 1 as viewed from a right side.

FIG. 8 is a schematic view showing a main part of a circuitconfiguration of a ground layer of the circuit board of the aerosolinhaler shown in FIG. 1 as viewed from the right side.

FIG. 9 is a schematic view showing a main part of a circuitconfiguration of a power supply layer of the circuit board of theaerosol inhaler shown in FIG. 1 as viewed from the right side.

FIG. 10 is a schematic view showing a main part of a circuitconfiguration of a second surface of the circuit board of the aerosolinhaler shown in FIG. 1 as viewed from the right side.

DESCRIPTION OF EMBODIMENTS

Hereinafter, an embodiment of an aerosol inhaler including a powersupply unit for an aerosol inhaler of the present invention will bedescribed with reference to the accompanying drawings.

Aerosol Inhaler

An aerosol inhaler 1 is an instrument for inhaling a perfumed aerosolwithout burning, which preferably has a size that fits in a hand, andhas a substantially rectangular parallelepiped shape. The aerosolinhaler 1 may also have an oval shape, an elliptical shape, or the like.In the following description, three directions orthogonal to the aerosolinhaler having the substantially rectangular parallelepiped shape willbe respectively referred to as an up-down direction, a front-reardirection, and a left-right direction in descending order of lengthsthereof. In the following description, a front side, a rear side, a leftside, a right side, an upper side, and a lower side are defined as shownin FIGS. 1 to 3, and the front side is represented by Fr, the rear sideis represented by Rr, the left side is represented by L, the right sideis represented by R, the upper side is represented by U, and the lowerside is represented by D for the sake of convenience.

As shown in FIGS. 1 to 3, the aerosol inhaler 1 includes a power supplyunit 10, a first cartridge 20, and a second cartridge 30. The firstcartridge 20 and the second cartridge 30 are attachable to anddetachable from the power supply unit 10. In other words, the firstcartridge 20 and the second cartridge 30 are replaceable.

Power Supply Unit

As shown in FIGS. 1 and 2, the power supply unit 10 accommodates, in asubstantially rectangular parallelepiped power supply unit case 11(hereinafter, also referred to as inside the case), a power supply 12,an internal holder 13, a circuit board 60, and various sensors such asan intake sensor 15.

The power supply unit case 11 includes a first case 11A and a secondcase 11B that are attachable and detachable in the left-right direction(thickness direction). The first case 11A and the second case 11B areassembled in the left-right direction (thickness direction) so as toform a front surface, a rear surface, a left surface, a right surface,and a lower surface of the power supply unit 10. An upper surface of thepower supply unit 10 is formed by a display device 16.

A mouthpiece 17 is provided on the upper surface of the power supplyunit 10 in front of the display device 16. An inhale port 17 a of themouthpiece 17 protrudes further upward as compared with the displaydevice 16.

An inclined surface that is inclined downward toward the rear side isprovided between the upper surface and the rear surface of the powersupply unit 10. An operation unit 18 that can be operated by a user isprovided on the inclined surface. The operation unit 18 includes abutton-type switch, a touch panel, and the like, and is used, forexample, when a micro controller unit (MCU) 50 and various sensors areactivated/shut off to reflect a use intention of the user.

A charge terminal 43 capable of being electrically connected to anexternal power supply (not shown) that can charge the power supply 12 isprovided on the lower surface of the power supply unit 10. The chargeterminal 43 is, for example, a receptacle to which a mating side plug(not shown) can be fitted. A receptacle or the like to which various USBterminals (plugs) can be connected can be adopted as the charge terminal43. In the present embodiment, as an example, the charge terminal 43 isa USB Type-C receptacle.

The charge terminal 43 may include, for example, a power receiving coil,and may be configured to receive power transmitted from the externalpower supply in a non-contact manner. A method of wireless powertransfer in this case may be an electromagnetic induction type method, amagnetic resonance type method, or a combination of the electromagneticinduction type method and the magnetic resonance type method. As anotherexample, the charge terminal 43 can be connected to various USBterminals, and may include the power receiving coil described above.

The internal holder 13 includes a rear wall 13 r extending along therear surface of the power supply unit 10, a central wall 13 c which isprovided at a front-rear direction central portion inside the case andextends parallel to the rear wall 13 r, an upper wall 13 u which extendsalong the display device 16 and connects the rear wall 13 r and thecentral wall 13 c, a partition wall 13 d which is orthogonal to the rearwall 13 r, the central wall 13 c, and the upper wall 13 u and divides aspace defined by the rear wall 13 r, the central wall 13 c, and theupper wall 13 u into a left space and a right space, and a cartridgeholding portion 13 a which is connected to the central wall 13 c andlocated in front of the central wall 13 c above the lower surface of thepower supply unit 10.

The power supply 12 is arranged in the left space of the internal holder13. The power supply 12 is a rechargeable secondary battery, an electricdouble layer capacitor or the like, and is preferably a lithium ionsecondary battery. An electrolyte of the power supply 12 may beconstituted by one of a gel electrolyte, an electrolytic solution, asolid electrolyte, an ionic liquid, or a combination thereof. In thepresent embodiment, an output voltage of the power supply 12 when thepower supply 12 is in a fully charged state (hereinafter, also referredto as a fully charged voltage) is 4.2 [V]. The output voltage of thepower supply 12 decreases as a remaining capacity of the power supply 12decreases. Then the power supply 12 stops discharging when the outputvoltage reaches a predetermined end-of-discharge voltage. Here, theend-of-discharge voltage is a voltage lower than 4.2 [V], which is thefully charged voltage, and may be, for example, about 3 [V]. A statewhere the discharging is stopped since the output voltage reaches theend-of-discharge voltage is hereinafter also referred to as anend-of-discharge state.

The L-shaped circuit board 60 is arranged in a space formed by the rightspace of the internal holder 13 and a lower space formed between thecartridge holding portion 13 a and the lower surface of the power supplyunit 10. The circuit board 60 is formed by stacking a plurality oflayers (four layers in the present embodiment) of boards, and is mountedwith electronic components (elements) such as a charging IC 55 and theMCU 50.

The charging IC 55 is an integrated circuit (IC) that controls chargingof the power supply 12 with power input from the charge terminal 43 andsupplies the power of the power supply 12 to the electronic componentsof the circuit board 60 and the like.

As shown in FIG. 5, the MCU 50 is connected to various sensor devices(such as the intake sensor 15 that detects a puff (intake) operation),the operation unit 18, a notification unit 45, and a memory 19 thatstores the number of times of puff operations, a time of energization toa load 21 or the like, and thus performs various types of control of theaerosol inhaler 1. Specifically, the MCU 50 mainly includes a processor,and further includes storage media, such as a random access memory (RAM)necessary for operations of the processor and a read only memory (ROM)that stores various types of information. More specifically, theprocessor in the present specification is an electric circuit in whichcircuit elements such as semiconductor elements are combined. A part ofelements (for example, the intake sensor 15 and the memory 19) connectedto the MCU 50 in FIG. 5 may also be provided inside the MCU 50 as afunction of the MCU 50 itself.

A cylindrical cartridge holder 14 that holds the first cartridge 20 isarranged in the cartridge holding portion 13 a.

A through hole 13 b that receives a discharge terminal 41 (see FIG. 3),which protrudes from the circuit board 60 toward the first cartridge 20,is provided in a lower end portion of the cartridge holding portion 13a. The discharge terminal 41 is, for example, a pin which isincorporated with a spring, and is configured to be electricallyconnectable to the load 21 of the first cartridge 20. The through hole13 b is larger than the discharge terminal 41, and is configured suchthat air flows into the first cartridge 20 through a gap formed betweenthe through hole 13 b and the discharge terminal 41.

The intake sensor 15 which detects the puff operation is provided on anouter peripheral surface 14 a of the cartridge holder 14 at a positionfacing the circuit board 60. The intake sensor 15 may be constituted bya condenser microphone, a pressure sensor, or the like. The cartridgeholder 14 is provided with a hole portion 14 b elongated in the up-downdirection through which a remaining amount of an aerosol source 22stored inside the first cartridge 20 can be visually checked, and isconfigured such that the user can visually check the remaining amount ofthe aerosol source 22 stored inside the first cartridge 20 through thehole portion 14 b of the first cartridge 20 from a translucent remainingamount check window 11 w provided in the power supply unit case 11.

As shown in FIG. 3, the mouthpiece 17 is detachably fixed to an upperend portion of the cartridge holder 14. The second cartridge 30 isdetachably fixed to the mouthpiece 17. The mouthpiece 17 includes acartridge accommodating portion 17 b that accommodates a part of thesecond cartridge 30, and a communication path 17 c that allows the firstcartridge 20 and the cartridge accommodating portion 17 b to communicatewith each other.

The power supply unit case 11 is provided with an air inlet 11 i throughwhich outside air is taken in. The air inlet 11 i is provided in, forexample, the remaining amount check window 11 w.

First Cartridge

As shown in FIG. 3, inside a cylindrical cartridge case 27, the firstcartridge 20 includes a reservoir 23 that stores the aerosol source 22,the electric load 21 that atomizes the aerosol source 22, a wick 24 thatdraws the aerosol source from the reservoir 23 to the load 21, and anaerosol flow path 25 through which aerosol generated by the atomizationof the aerosol source 22 flows toward the second cartridge 30.

The reservoir 23 is partitioned to surround a periphery of the aerosolflow path 25. The reservoir 23 stores the aerosol source 22. A porousbody, such as a resin web or cotton, may be accommodated in thereservoir 23, and the aerosol source 22 may be impregnated in the porousbody. The reservoir 23 may only store the aerosol source 22 withoutaccommodating the porous body such as the resin web or cotton. Theaerosol source 22 includes a liquid such as glycerin, propylene glycolor water.

The wick 24 is a liquid holding member that draws the aerosol source 22from the reservoir 23 to the load 21 by utilizing a capillaryphenomenon. The wick 24 is made of, for example, glass fibers or porousceramic.

The load 21 atomizes the aerosol source 22 by heating the aerosol source22 by power supplied from the power supply 12 via the discharge terminal41 without burning. The load 21 is formed of an electric heating wire(coil) wound at a predetermined pitch. The load 21 may also be anyelement that can atomize the aerosol source 22 to generate the aerosol.The load 21 is, for example, a heat generating element. Examples of theheat generating element include a heat generating resistor, a ceramicheater, and an induction heating type heater.

The aerosol flow path 25 is provided on a center line of the firstcartridge 20 on a downstream side of the load 21.

Second Cartridge

The second cartridge 30 stores a perfume source 31. The second cartridge30 is detachably accommodated in the cartridge accommodating portion 17b provided in the mouthpiece 17.

The aerosol generated by atomizing the aerosol source 22 by the load 21is passed through the perfume source 31 in the second cartridge 30, sothat the aerosol is imparted with a perfume. Chopped tobacco or a moldedbody obtained by molding a tobacco raw material into particles can beused as a raw material piece that forms the perfume source 31. Theperfume source 31 may also be formed of a plant other than tobacco (forexample, mint, Chinese herb, or herb). The perfume source 31 may also beprovided with a fragrance such as menthol.

According to the aerosol inhaler 1 of the present embodiment, theperfumed aerosol can be generated by the aerosol source 22, the perfumesource 31, and the load 21. That is, the aerosol source 22 and theperfume source 31 constitute an aerosol generation source that generatesthe aerosol to which the perfume is imparted.

In addition to a configuration in which the aerosol source 22 and theperfume source 31 are separated from each other, a configuration inwhich the aerosol source 22 and the perfume source 31 are integrallyformed, a configuration in which the perfume source 31 is omitted andsubstances that can be included in the perfume source 31 are added tothe aerosol source 22, or a configuration in which a medicine or thelike is added to the aerosol source 22 instead of the perfume source 31may also be employed as the configuration of the aerosol generationsource used in the aerosol inhaler 1.

According to the aerosol inhaler 1 configured as described above, asindicated by an arrow A in FIG. 3, air flowing in from the air inlet 11i provided in the power supply unit case 11 passes through the vicinityof the load 21 of the first cartridge 20 via the gap formed between thethrough hole 13 b and the discharge terminal 41. The load 21 atomizesthe aerosol source 22 drawn by the wick 24 from the reservoir 23. Theaerosol generated by the atomization flows through the aerosol flow path25 together with the air flowing in from the inlet, and is supplied tothe second cartridge 30 via the communication path 17 c. The aerosolsupplied to the second cartridge 30 passes through the perfume source 31so as to be perfumed, and is then supplied to the inhale port 32.

The aerosol inhaler 1 is provided with the notification unit 45 thatnotifies various types of information (see FIG. 5). The notificationunit 45 may be constituted by a light emitting element, a vibratingelement, or a sound output element. The notification unit 45 may also bea combination of two or more elements among the light emitting element,the vibrating element, and the sound output element. The notificationunit 45 may be provided in any one of the power supply unit 10, thefirst cartridge 20, and the second cartridge 30, and is preferablyprovided in the power supply unit 10, which is not a consumable item.

In the present embodiment, an organic light emitting diode (OLED) panel46 and a vibrator 47 are provided as the notification unit 45. When anorganic light emitting diode (OLED) provided in the OLED panel 46 emitslight, various types of information are notified to the user via thedisplay device 16. Further, when the vibrator 47 vibrates, various typesof information are notified to the user via the power supply unit case11. The notification unit 45 may be provided with only one of the OLEDpanel 46 and the vibrator 47, or may be provided with another lightemitting element or the like. The information notified by the OLED panel46 and the information notified by the vibrator 47 may be different orthe same.

Electric Circuit

Next, details of an electric circuit of the power supply unit 10 will bedescribed with reference to FIG. 4.

As shown in FIG. 4, the power supply unit 10 includes, as maincomponents, the power supply 12, the charge terminal 43, the MCU 50, thecharging IC 55, a protection IC 61, a low drop-out (LDO) regulator 62, afirst DC/DC converter 63, a second DC/DC converter 64, a display driver65, the intake sensor 15, the OLED panel 46, and the vibrator 47.

As described above, the charge terminal 43 is a receptacle to which themating side plug can be fitted, and includes a plurality of pins(terminals) that are electrically connected to a pin of the plug whenthe plug is fitted. Specifically, the charge terminal 43 includes an A1pin (indicated by “A1” in the drawings), an A4 pin (indicated by “A4” inthe drawings), an A5 pin (indicated by “A5” in the drawings), an A6 pin(indicated by “A6” in the drawings), an A7 pin (indicated by “A7” in thedrawings), an A8 pin (indicated by “A8” in the drawings), an A9 pin(indicated by “A9” in the drawings), an A12 pin (indicated by “A12” inthe drawings), a B1 pin (indicated by “B1” in the drawings), a B4 pin(indicated by “B4” in the drawings), a B5 pin (indicated by “B5” in thedrawings), a B6 pin (indicated by “B6” in the drawings), a B7 pin(indicated by “B7” in the drawings), a B8 pin (indicated by “B8” in thedrawings), a B9 pin (indicated by “B9” in the drawings), and a B12 pin(indicated by “B12” in the drawings).

The A1 pin, the A4 pin, the A5 pin, the A6 pin, the A7 pin, the A8 pin,the A9 pin, the A12 pin, and the B1 pin, the B4 pin, the B5 pin, the B6pin, the B7 pin, the B8 pin, the B9 pin, the B12 pin are arranged to bepoint symmetrical relative to a center of a fitting surface where thecharge terminal 43 is fitted with the plug. Therefore, the plug can befitted to the charge terminal 43 regardless of an up-down orientation ofthe plug, and convenience for the user can thus be improved.

It should be noted that only main pins among the pins included in thecharge terminal 43 are described in the present embodiment. Although theA8 pin and the B8 pin are provided in the charge terminal 43 in thepresent embodiment, as will be described later below, such pins are notused and may be omitted.

The protection IC 61 is an IC having a function of converting a voltageinput via the charge terminal 43 into a predetermined voltage asnecessary and outputting the converted voltage. Specifically, theprotection IC 61 converts the input voltage into a voltage included in arange between a minimum value and a maximum value of a recommended inputvoltage of the charging IC 55. As a result, even when a high voltageexceeding the maximum value of the recommended input voltage of thecharging IC 55 is input via the charge terminal 43, the protection IC 61can protect the charging IC 55 from the high voltage. As an example,when the minimum value of the recommended input voltage of the chargingIC 55 is 4.35 [V] while the maximum value is 6.4 [V], the protection IC61 converts the input voltage into 5.5 ±0.2 [V] and outputs theconverted voltage to the charging IC 55. When the above-described highvoltage is input via the charge terminal 43, the protection IC 61 mayprotect the charging IC 55 by opening a circuit that connects an inputterminal (denoted by IN in FIG. 4) and an output terminal (denoted byOUT in FIG. 4) of the protection IC 61. The protection IC 61 may alsohave various protection functions for protecting the electric circuit ofthe power supply unit 10, such as overcurrent detection and overvoltagedetection.

The protection IC 61 includes a plurality of pins (terminals) configuredto electrically connect inside and outside of the protection IC 61.Specifically, the protection IC 61 includes an IN pin (indicated by “IN”in the drawings), a VSS pin (indicated by “VSS” in the drawings), a GNDpin (indicated by “GND” in the drawings), an OUT pin (indicated by “OUT”in the drawings), a VBAT pin (indicated by “VBAT” in the drawings), anda CE pin (indicated by “CE” in the drawings).

In the protection IC 61, the IN pin is a pin to which the power suppliedfrom the charge terminal 43 is input. The VSS pin is a pin to whichpower for operating the protection IC 61 is input. The GND pin is agrounded pin. The OUT pin is a pin that outputs power to the charging IC55. The VBAT pin is a pin for the protection IC 61 to detect a state ofthe power supply 12. The CE pin is a pin that switches ON and OFF of theprotection functions provided by the protection IC 61. It should benoted that only main pins among the pins included in the protection IC61 are described in the present embodiment.

The charging IC 55 is an IC which has a function of controlling chargingto the power supply 12 and a function of supplying power of the powersupply 12 to the LDO regulator 62, the first DC/DC converter 63, thesecond DC/DC converter 64, and the like. For example, the charging IC 55supplies a standard system voltage corresponding to an output of thepower supply 12 at that time to the LDO regulator 62, the first DC/DCconverter 63, the second DC/DC converter 64, and the like. Here, thestandard system voltage refers to a voltage that is higher than alow-voltage system voltage to be described later below and lower than afirst high-voltage system voltage and a second high-voltage systemvoltage. The standard system voltage is, for example, the output voltageof the power supply 12, and can be a voltage of about 3 to 4.2 [V].

Further, the charging IC 55 also has a power-path function of supplyingthe power input via the charge terminal 43 to systems such as the LDOregulator 62, the first DC/DC converter 63, and the second DC/DCconverter 64. By using this power-path function, power can be suppliedto the systems of the power supply unit 10, such as the LDO regulator62, the first DC/DC converter 63, and the second DC/DC converter 64 evenduring charging of the power supply 12. Therefore, when such systems ofthe power supply unit 10 are used during charging of the power supply12, such systems of the power supply unit 10 can be used while a burdenof the power supply 12 is reduced (that is, deterioration of the powersupply 12 is prevented). In addition, it is also possible to improve acharging speed of the power supply 12 and shorten a charging timethereof. Even when the power supply 12 is over-discharged, it ispossible to use the power-path function to restore the systems of thepower supply unit 10.

The charging IC 55 includes a plurality of pins (terminals) configuredto electrically connect inside and outside of the charging IC 55.Specifically, the charging IC 55 includes an IN pin (indicated by “IN”in the drawings), a BAT_1 pin (indicated by “BAT_1” in the drawings), aBAT_2 pin (indicated by “BAT_2” in the drawings), an ISET pin (indicatedby “ISET” in the drawings), a TS pin (indicated by “TS” in thedrawings), an OUT_1 pin (indicated by “OUT_1” in the drawings), an OUT_2pin (indicated by “OUT_2” in the drawings), an ILIM pin (indicated by“ILIM” in the drawings), and a CHG pin (indicated by “CHG” in thedrawings).

It should be noted that only main pins among the pins included in thecharging IC 55 are described in the present embodiment. Although thecharging IC 55 is provided with the BAT_1 pin and the BAT_2 pin in thepresent embodiment, the BAT_1 pin and the BAT_2 pin may also be combinedas one single pin. Similarly, although the charging IC 55 is providedwith the OUT_1 pin and the OUT_2 pin in the present embodiment, theOUT_1 pin and the OUT_2 pin may also be combined as one single pin.

The LDO regulator 62 is an IC which has a function of generating thelow-voltage system voltage from the input standard system voltage andoutputting the generated low-voltage system voltage. Here, thelow-voltage system voltage refers to a voltage lower than the standardsystem voltage described above, and is, for example, a voltage suitablefor operating the MCU 50 and the intake sensor 15. An example of thelow-voltage system voltage is 2.5 [V].

The LDO regulator 62 includes a plurality of pins (terminals) configuredto electrically connect inside and outside of the LDO regulator 62.Specifically, the LDO regulator 62 includes an IN pin (indicated by “IN”in the drawings), a GND pin (indicated by “GND” in the drawings), an OUTpin (indicated by “OUT” in the drawings), and an EN pin (indicated by“EN” in the drawings). It should be noted that only main pins among thepins provided in the LDO regulator 62 are described in the presentembodiment.

The MCU 50 is an IC that operates through using the input low-voltagesystem voltage as a power source and functions as a control device thatperforms various types of control of the aerosol inhaler 1. For example,the MCU 50 can control heating of the load 21 by controlling on and offof a switch SW4, which will be described later below, provided in theelectric circuit of the power supply unit 10. The MCU 50 can alsocontrol a display of the display device 16 by controlling the displaydriver 65. Further, the MCU 50 can control vibration of the vibrator 47by controlling on and off of a switch SW3, which will be described laterbelow, provided in the electric circuit of the power supply unit 10.

The MCU 50 includes a plurality of pins (terminals) configured toelectrically connect inside and outside of the MCU 50. Specifically, theMCU 50 includes a VDD pin (indicated by “VDD” in the drawings), aVDD_USB pin (indicated by “VDD_USB” in the drawings), a VSS pin(indicated by “VSS” in the drawings), a PC1 pin (indicated by “PC1” inthe drawings), a PA8 pin (indicated by “PA8” in the drawings), a PB3 pin(indicated by “PB3” in the drawings), a PB15 pin (indicated by “PB15” inthe drawings), a PB4 pin (indicated by “PB4” in the drawings), a PC6 pin(indicated by “PC6” in the drawings), a PA0 pin (indicated by “PA0” inthe drawings), a PC5 pin (indicated by “PC5” in the drawings), a PA11pin (indicated by “PA11” in the drawings), a PA12 pin (indicated by“PA12” in the drawings), a PC12 pin (indicated by “PC12” in thedrawings), a PB8 pin (indicated by “PB8” in the drawings), and a PB9 pin(indicated by “PB9” in the drawings).

It should be noted that only main pins among the pins provided in theMCU 50 are described in the present embodiment. Although the MCU 50 isprovided with the VDD pin and the VDD_USB pin in the present embodiment,the VDD pin and the VDD_USB pin may also be combined as one single pin.

The intake sensor 15 is a sensor device that detects the puff operationas described above, and is, for example, a sensor device configured tooutput a signal indicating, as a detection result, a value of a changein pressure (internal pressure) in the power supply unit 10 caused byinhale of the user through the inhale port 32 as will be described laterbelow.

The intake sensor 15 includes a plurality of pins (terminals) configuredto electrically connect inside and outside of the intake sensor 15.Specifically, the intake sensor 15 includes a VCC pin (indicated by“VCC” in the drawings), a GND pin (indicated by “GND” in the drawings),and an OUT pin (indicated by “OUT” in the drawings). It should be notedthat only main pins among the pins included in the intake sensor 15 aredescribed in the present embodiment.

The vibrator 47 includes, for example, a positive electrode sideterminal 47 a, a negative electrode side terminal 47 b, a motor (notshown) that rotates a rotation shaft in accordance with a voltage inputfrom the positive electrode side terminal 47 a and the negativeelectrode side terminal 47 b, and an eccentric weight (not shown)attached to the rotation shaft of the motor. When the low-voltage systemvoltage is input to the vibrator 47, the motor and the eccentric weightare rotated to generate vibration.

In the present specification, the term “positive electrode side” refersto a higher potential side as compared with the “negative electrodeside”. That is, in the following description, the term “positiveelectrode side” may be read as a “high potential side”. In the presentspecification, the term “negative electrode side” refers to a lowerpotential side as compared with the “positive electrode side”. That is,in the following description, the term “negative electrode side” may beread as a “low potential side”.

The first DC/DC converter 63 is an IC which has a function of generatingthe first high-voltage system voltage from the input standard systemvoltage and outputting the generated first high-voltage system voltage.Here, the first high-voltage system voltage refers to a voltage higherthan the standard system voltage described above. That is, the firstDC/DC converter 63 boosts the input standard system voltage to the firsthigh-voltage system voltage and outputs the first high-voltage systemvoltage. The first high-voltage system voltage is, for example, avoltage suitable for heating the load 21, and is, as an example, 4.2[V].

The first DC/DC converter 63 includes a plurality of pins (terminals)configured to electrically connect inside and outside of the first DC/DCconverter 63. Specifically, the first DC/DC converter 63 includes a VINpin (indicated by “VIN” in the drawings), a SW pin (indicated by “SW” inthe drawings), a GND pin (indicated by “GND” in the drawings), a VOUTpin (indicated by “VOUT” in the drawings), a MODE pin (indicated by“MODE” in the drawings), and an EN pin (indicated by “EN” in thedrawings). It should be noted that only main pins among the pinsincluded in the first DC/DC converter 63 are described in the presentembodiment.

The second DC/DC converter 64 is an IC which has a function ofgenerating the second high-voltage system voltage from the inputstandard system voltage and outputting the generated second high-voltagesystem voltage. Here, the second high-voltage system voltage refers to avoltage higher than the standard system voltage described above. Thatis, the second DC/DC converter 64 boosts the input standard systemvoltage to the second high-voltage system voltage and outputs the secondhigh-voltage system voltage. The second high-voltage system voltage ishigher than the first high-voltage system voltage, and is, for example,a voltage suitable for operating the OLED panel 46. Specifically, thesecond high-voltage system voltage is, for example, about 10 to 15 [V].

The second DC/DC converter 64 includes a plurality of pins (terminals)configured to electrically connect inside and outside of the secondDC/DC converter 64. Specifically, the second DC/DC converter 64 includesa VIN pin (indicated by “VIN” in the drawings), a SW pin (indicated by“SW” in the drawings), a GND pin (indicated by “GND” in the drawings), aVOUT pin (indicated by “VOUT” in the drawings), and an EN pin (indicatedby “EN” in the drawings). It should be noted that only main pins amongthe pins included in the second DC/DC converter 64 are described in thepresent embodiment.

The display driver 65 is an IC that operates through using the inputlow-voltage system voltage as a power source, and has a function ofcontrolling the OLED panel 46 and supplying the second high-voltagesystem voltage to the OLED panel 46 to control the display of thedisplay device 16.

The display driver 65 includes a plurality of pins (terminals)configured to electrically connect inside and outside of the displaydriver 65. Specifically, the display driver 65 includes a VDD pin(indicated by “VDD” in the drawings), a VSS pin (indicated by “VSS” inthe drawings), a VCC_C pin (indicated by “VCC_C” in the drawings), anSDA pin (indicated by “SDA” in the drawings), an SCL pin (indicated by“SCL” in the drawings), and an IXS pin (indicated by “IXS” in thedrawings). It should be noted that only main pins among the pinsincluded in the display driver 65 are described in the presentembodiment.

The components of the power supply unit 10 described above areelectrically connected to each other by a conducting wire or the likeprovided on the circuit board 60. Hereinafter, electric connection ofeach component of the power supply unit 10 will be described in detail.

The A1 pin, the A12 pin, the B1 pin and the B12 pin of the chargeterminal 43 are ground pins. The A1 pin and the B12 pin are connected inparallel, and are grounded by a ground line 60N. Similarly, the A12 pinand the B1 pin are also connected in parallel, and are grounded by theground line 60N. In FIG. 4, the ground line 60N (that is, a line ofapproximately 0 [V], which is a reference potential of the circuit board60) is indicated by a thick solid line.

The A4 pin, the A9 pin, the B4 pin, and the B9 pin of the chargeterminal 43 are pins that receive an input of power to the power supplyunit 10 when a plug of the external power supply is fitted to the chargeterminal 43. For example, when the plug is fitted to the charge terminal43, predetermined USB bus power is supplied from the fitted plug to thepower supply unit 10 via the A4 pin and the B9 pin or the A9 pin and theB4 pin. Power corresponding to USB power delivery (USBPD) may also besupplied to the power supply unit 10 from the plug of the external powersupply which is fitted to the charge terminal 43.

Specifically, the A4 pin and the B9 pin are connected in parallel, andare connected to the IN pin of the protection IC 61 via a power supplyline 60A. The IN pin of the protection IC 61 is a positive electrodeside power supply pin of the protection IC 61. The A9 pin and the B4 pinare also connected in parallel, and are connected to the IN pin of theprotection IC 61 via the power supply line 60A.

The power supply line 60A is connected to the ground line 60N via avaristor (variable resistor: nonlinear resistance element) VR1.Specifically, one end of the varistor VR1 is connected to a node N11provided on the power supply line 60A, while the other end is connectedto the ground line 60N. Here, the node N11 is provided closer to theprotection IC 61 as compared with a node connected to the A4 pin and theB9 pin and a node connected to the A9 pin and the B4 pin on the powersupply line 60A. Therefore, for example, even if static electricity isgenerated in the A4 pin, the A9 pin, the B4 pin, or the B9 pin due tofriction between the charge terminal 43 and the plug when the plug isfitted to the charge terminal 43, the static electricity can be releasedto the ground line 60N via the varistor VR1 so as to protect theprotection IC 61.

The power supply line 60A is connected to the ground line 60N via acapacitor CD1 that functions as a decoupling capacitor (also referred toas a bypass capacitor). As a result, a voltage input to the protectionIC 61 via the power supply line 60A can be stabilized. Specifically, oneend of the capacitor CD1 is connected to a node N12 provided on thepower supply line 60A, while the other end is connected to the groundline 60N. Here, the node N12 is provided closer to the protection IC 61as compared with the node N11 on the power supply line 60A. Therefore,even if static electricity is generated in the A4 pin, the A9 pin, theB4 pin, or the B9 pin, the capacitor CD1 can be protected by thevaristor VR1 from the static electricity. That is, by providing the nodeN12 which is closer to the protection IC 61 as compared with the nodeN11 on the power supply line 60A, the protection IC 61 can be protectedfrom overvoltage while a stable operation of the protection IC 61 can beachieved.

The A6 pin, the A7 pin, the B6 pin, and the B7 pin of the chargeterminal 43 are pins used to input and output signals for communicationbetween the power supply unit 10 and an external device. In the presentembodiment, serial communication during which signals are differentiallytransmitted by two signal lines Dp (also referred to as D+) and Dn (alsoreferred to as D−) is used for the communication between the powersupply unit 10 and the external device.

The A6 pin and the B6 pin are pins corresponding to a Dp side signalline. The A6 pin and the B6 pin are connected in parallel, and areconnected to the PA12 pin of the MCU 50 via a resistor R1. The resistorR1 is an element which includes a resistance element, a transistor, orthe like and has a predetermined electric resistance value. The PA12 pinof the MCU 50 is a pin used to input and output a signal of the MCU 50.Therefore, a Dp side signal from the external device can be input to theMCU 50 via the A6 pin or the B6 pin. A Dp side signal from the MCU 50can also be output to the external device via the A6 pin or the B6 pin.

The A6 pin and the B6 pin are also connected to the ground line 60N viaa varistor VR2. Therefore, for example, even if static electricity isgenerated in the A6 pin or the B6 pin due to the friction between thecharge terminal 43 and the plug when the plug is fitted to the chargeterminal 43, the static electricity can be released to the ground line60N via the varistor VR2 so as to protect the MCU 50. Further, since theresistor R1 is provided between the A6 pin, the B6 pin and the MCU 50,the resistor R1 can also prevent input of a high voltage to the MCU 50,and the MCU 50 can thus be protected.

The A7 pin and the B7 pin are pins corresponding to a Dn side signalline. The A7 pin and the B7 pin are connected in parallel, and areconnected to the PA11 pin of the MCU 50 via a resistor R2. The resistorR2 is an element which includes a resistance element, a transistor, orthe like and has a predetermined electric resistance value. The PA11 pinof the MCU 50 is a pin used to input and output the signal of the MCU50. Therefore, a Dn side signal from the external device can be input tothe MCU 50 via the A7 pin or the B7 pin. A Dn side signal from the MCU50 can also be output to the external device via the A7 pin or the B7pin.

The A7 pin and the B7 pin are also connected to the ground line 60N viaa varistor VR3. Therefore, for example, even if static electricity isgenerated in the A7 pin or the B7 pin due to the friction between thecharge terminal 43 and the plug when the plug is fitted to the chargeterminal 43, the static electricity can be released to the ground line60N via the varistor VR3 so as to protect the MCU 50. Further, since theresistor R2 is provided between the A7 pin, the B7 pin and the MCU 50,the resistor R2 can also prevent the input of the high voltage to theMCU 50, and the MCU 50 can thus be protected.

The A5 pin and the B5 pin of the charge terminal 43 are pins used todetect the up-down orientation of the plug which is fitted to the chargeterminal 43. For example, the A5 pin is a pin corresponding to a signalline of a so-called CC1 signal, while the B5 pin is a pin correspondingto a signal line of a so-called CC2 signal. The A5 pin is connected tothe ground line 60N via a resistor R3, while the B5 pin is connected tothe ground line 60N via a resistor R4.

The A8 pin and the B8 pin of the charge terminal 43 are not connected tothe electric circuit of the power supply unit 10. Therefore, the A8 pinand the B8 pin are not used, and may be omitted.

As described above, the IN pin of the protection IC 61 is the positiveelectrode side power supply pin of the protection IC 61, and isconnected to the power supply line 60A. The VSS pin of the protection IC61 is a negative electrode side power supply pin of the protection IC61, and is connected to the ground line 60N. The GND pin of theprotection IC 61 is a ground pin of the protection IC 61, and isconnected to the ground line 60N. As a result, when the plug is fittedto the charge terminal 43, power (for example, USB bus power) issupplied to the protection IC 61 via the power supply line 60A.

The OUT pin of the protection IC 61 is a pin that directly outputs powerinput to the IN pin or outputs a voltage converted by the protection IC61 (for example, 5.5±0.2 [V]), and is connected to the IN pin of thecharging IC 55 via a power supply line 60B. The IN pin of the chargingIC 55 is a positive electrode side power supply pin of the charging IC55. As a result, an appropriate voltage converted by the protection IC61 is supplied to the charging IC 55.

The power supply line 60B is connected to the ground line 60N via acapacitor CD2 which functions as a decoupling capacitor. As a result, avoltage input to the charging IC 55 via the power supply line 60B can bestabilized.

The VBAT pin of the protection IC 61 is a pin used by the protection IC61 to detect whether the power supply 12 is connected, and is connectedto a positive electrode side terminal 12 a of the power supply 12 via aresistor R5. The resistor R5 is an element which includes a resistanceelement, a transistor, or the like and has a predetermined electricresistance value. The protection IC 61 can detect that the power supply12 is connected based on a voltage input to the VBAT pin.

The CE pin of the protection IC 61 is a pin configured to turn on andoff an operation (various functions) of the protection IC 61.Specifically, the protection IC 61 operates when a low-level voltage isinput to the CE pin, and stops the operation when a high-level voltageis input to the CE pin. In the present embodiment, the CE pin of theprotection IC 61 is connected to the ground line 60N, and the low-levelvoltage is always input to the CE pin. Therefore, the protection IC 61always operates during a supply of power, and performs conversion to apredetermined voltage, overcurrent detection, overvoltage detection, andthe like.

Instead of the protection IC 61 in the present embodiment, a protectionIC that operates when a high-level voltage is input to a CE pin andstops the operation when a low-level voltage is input to the CE pin maybe used. However, it should be noted that the CE pin of the protectionIC in this case needs to be connected to the power supply line 60B orthe power supply line 60A instead of the ground line 60N.

As described above, the IN pin of the charging IC 55 is the positiveelectrode side power supply pin of the charging IC 55, and is connectedto the power supply line 60B. The charging IC 55 is also connected tothe ground line 60N by, for example, a negative electrode side powersupply pin (not shown). As a result, a voltage output from theprotection IC 61 is supplied to the charging IC 55 via the power supplyline 60B.

The BAT_1 pin and the BAT_2 pin of the charging IC 55 are pins used toexchange power between the charging IC 55 and the power supply 12, andare connected to the positive electrode side terminal 12 a of the powersupply 12 via a power supply line 60C. A negative electrode sideterminal 12 b of the power supply 12 is connected to the ground line60N.

Specifically, the BAT_1 pin and the BAT_2 pin are connected in parallel,connected to the positive electrode side terminal 12 a and connected tothe ground line 60N via a capacitor CD3. When the power supply 12 isdischarged, electric charges are accumulated in the capacitor CD3, and avoltage output from the power supply 12 is input to the BAT_1 pin andthe BAT_2 pin. When the power supply 12 is charged, a voltage forcharging the power supply 12 is output from the BAT_1 pin and the BAT_2pin, and is applied to the positive electrode side terminal 12 a of thepower supply 12 via the power supply line 60C.

The power supply line 60C is connected to the ground line 60N via acapacitor CD4 which functions as a decoupling capacitor. As a result, avoltage input to the power supply 12 via the power supply line 60C canbe stabilized.

The ISET pin of the charging IC 55 is a pin configured to set a currentvalue output from the charging IC 55 to the power supply 12. In thepresent embodiment, the ISET pin is connected to the ground line 60N viaa resistor R6. Here, the resistor R6 is an element which includes aresistance element, a transistor, or the like and has a predeterminedelectric resistance value.

The charging IC 55 outputs, to the power supply 12, a current which hasa current value corresponding to the electric resistance value of theresistor R6 connected to the ISET pin.

The TS pin of the charging IC 55 is a pin to which a voltage valueapplied to a resistor connected thereto is input, and is a pin which isused to detect an electric resistance value and a temperature of theresistor connected to the TS pin based on the voltage value.

In the present embodiment, the TS pin is connected to the ground line60N via a resistor R7. Here, the resistor R7 is an element (for example,a thermistor) which includes a resistance element, a transistor, or thelike and has a predetermined electric resistance value. Therefore, thecharging IC 55 can detect an electric resistance value and a temperatureof the resistor R7 based on a voltage value applied to the resistor R7.

The CHG pin of the charging IC 55 is a pin that outputs information on acharging state of the power supply 12 (hereinafter, also referred to ascharging state information), such as charging, charging stopped, andcharging completed, and information on the remaining capacity of thepower supply 12 (hereinafter, also referred to as remaining capacityinformation). The CHG pin of the charging IC 55 is connected to the PB15 pin of the MCU 50. The PB 15 pin of the MCU 50 is a pin used to inputa signal in the MCU 50. Therefore, the charging IC 55 can notify the MCU50 of the charging state, the remaining capacity, and the like of thepower supply 12 by outputting the charging state information and theremaining capacity information from the CHG pin to the MCU 50.

The OUT_1 pin and the OUT_2 pin of the charging IC 55 are pins fromwhich the standard system voltage is output, and are connected to the INpin of the LDO regulator 62, the VIN pin of the first DC/DC converter63, and the VIN pin of the second DC/DC converter 64 via a power supplyline 60D. The IN pin of the LDO regulator 62 is a positive electrodeside power supply pin of the LDO regulator 62. The VIN pin of the firstDC/DC converter 63 is a positive electrode side power supply pin of thefirst DC/DC converter 63. The VIN pin of the second DC/DC converter 64is a positive electrode side power supply pin of the second DC/DCconverter 64.

Specifically, the OUT_1 pin is connected, via a capacitor CD5 whichfunctions as a decoupling capacitor, to the ground line 60N andconnected to the OUT_2 pin. The OUT_1 pin and the OUT_2 pin areconnected, via a capacitor CD6 which functions as a decouplingcapacitor, to the ground line 60N, and are also connected to the IN pinof the LDO regulator 62, the VIN pin of the first DC/DC converter 63,and the VIN pin of the second DC/DC converter 64. As a result, thecharging IC 55 can stably supply the standard system voltage to the LDOregulator 62, the first DC/DC converter 63, and the second DC/DCconverter 64.

Further, in the present embodiment, a capacitor CD7 which functions as adecoupling capacitor is also provided immediately before the first DC/DCconverter 63 on the power supply line 60D. As a result, the standardsystem voltage can be stably supplied to the first DC/DC converter 63,while power supply from the first DC/DC converter 63 to the load 21 canbe stabilized.

The ILIM pin of the charging IC 55 is a pin configured to set an upperlimit of a current value output from the charging IC 55 to the LDOregulator 62, the first DC/DC converter 63, and the second DC/DCconverter 64. In the present embodiment, the ILIM pin is connected tothe ground line 60N via the resistor R7. Here, the resistor R7 is anelement which includes a resistance element, a transistor, or the likeand has a predetermined electric resistance value.

The charging IC 55 outputs, to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64, a current whose upperlimit has a current value corresponding to the electric resistance valueof the resistor R7 connected to the ILIM pin. More specifically, thecharging IC 55 outputs a current having a current value corresponding tothe electric resistance value of the resistor R6 connected to the ISETpin from the OUT_1 pin and the OUT_2 pin, and stops outputting thecurrent from the OUT_1 pin and the OUT_2 pin when the current valuereaches the current value corresponding to the electric resistance valueof the resistor R7 connected to the ILIM pin. That is, a manufacturer ofthe aerosol inhaler 1 can set the upper limit value of the currentoutput from the charging IC 55 to the LDO regulator 62, the first DC/DCconverter 63, and the second DC/DC converter 64 by the electricresistance value of the resistor R7 connected to the ILIM pin.

An LED circuit C1 is provided by branching from the power supply line60D. The LED circuit C1 is configured by connecting a resistor R8, anLED 70, and a switch SW1 in series. One end of the LED circuit C1 on theside of the resistor R8 is connected to a node N21 provided on the powersupply line 60D. The other end of the LED circuit C1 on the side of theswitch SW1 is connected to the ground line 60N.

Here, the resistor R8 is an element which includes a resistance element,a transistor, or the like and has a predetermined electric resistancevalue. The resistor R8 is mainly used to limit a voltage applied to theLED 70 and/or a current supplied to the LED 70. The LED 70 is a lightemitting unit that is provided at a position corresponding to theremaining amount check window 11 w inside the power supply unit 10 andis configured to illuminate an outer side of the power supply unit 10from the inside of the power supply unit 10 via the remaining amountcheck window 11 w. The LED 70 emits light to improve visibility of aremaining amount of the first cartridge 20 (specifically, a remainingamount of the aerosol source 22 stored in the first cartridge 20) seenvia the remaining amount check window 11 w.

The switch SW1 is, for example, a switch configured by a MOSFET. Theswitch SW1 is connected to the MCU 50 which will be described laterbelow. The switch SW1 is turned on in response to an ON command of theMCU 50, and is turned off in response to an OFF command of the MCU 50.The LED circuit C1 is brought into a conductive state when the switchSW1 is turned on. Then the LED 70 emits light when the LED circuit C1 isin the conductive state.

As described above, the IN pin of the LDO regulator 62 is the positiveelectrode side power supply pin of the LDO regulator 62, and isconnected to the power supply line 60D. The GND pin of the LDO regulator62 is a ground pin of the LDO regulator 62, and is connected to theground line 60N. As a result, the standard system voltage output fromthe charging IC 55 is supplied to the LDO regulator 62 via the powersupply line 60D.

The OUT pin of the LDO regulator 62 is a pin to which the low-voltagesystem voltage generated by the LDO regulator 62 is output, and isconnected to the VDD pin and the VDD_USB pin of the MCU 50, the VCC pinof the intake sensor 15, the VDD pin and the IXS pin of the displaydriver 65, and the positive electrode side terminal 47 a of the vibrator47 via a power supply line 60E. The VDD pin and the VDD_USB pin of theMCU 50 are positive electrode side power supply pins of the MCU 50. TheVCC pin of the intake sensor 15 is a positive electrode side powersupply pin of the intake sensor 15. The VDD pin of the display driver 65is a positive electrode side power supply pin of the display driver 65.As a result, the LDO regulator 62 can supply the low-voltage systemvoltage to the MCU 50, the intake sensor 15, the display driver 65, andthe vibrator 47.

The EN pin of the LDO regulator 62 is a pin configured to turn on andoff an operation (function) of the LDO regulator 62. Specifically, theLDO regulator 62 operates when a high-level voltage is input to the ENpin, and stops the operation when the high-level voltage is not input tothe EN pin.

In the present embodiment, the EN pin of the LDO regulator 62 isconnected to the power supply line 60D and is also connected to theground line 60N via a capacitor CD8. Therefore, when the standard systemvoltage is output from the charging IC 55, electric charges areaccumulated in the capacitor CD8, the high-level voltage is input to theEN pin of the LDO regulator 62, and thus the LDO regulator 62 isoperated to output the low-voltage system voltage from the LDO regulator62.

As described above, the VDD pin and the VDD_USB pin of the MCU 50 arethe positive electrode side power supply pins of the MCU 50, and areconnected to the power supply line 60E. The VSS pin of the MCU 50 is anegative electrode side power supply pin of the MCU 50, and is connectedto the ground line 60N. As a result, the low-voltage system voltageoutput from the LDO regulator 62 is supplied to the MCU 50 via the powersupply line 60E. The VDD pin and the VDD_USB pin may also be combined asone single pin.

A thermistor circuit C2 is provided by branching from the power supplyline 60E. The thermistor circuit C2 is configured by connecting a switchSW2, a resistor R9, and a thermistor TH in series. One end of thethermistor circuit C2 on the side of the switch SW2 is connected to anode N31 provided on the power supply line 60E. The other end of thethermistor circuit C2 on the side of the thermistor TH is connected tothe ground line 60N.

Here, the switch SW2 is, for example, a switch configured by a MOSFET.The switch SW2 is connected to the MCU 50 which will be described laterbelow. The switch SW2 is turned on in response to the on command of theMCU 50, and is turned off in response to the off command of the MCU 50.The thermistor circuit C2 is brought into a conductive state when theswitch SW2 is turned on.

The resistor R9 is an element which includes a resistance element, atransistor, or the like and has a predetermined electric resistancevalue. The thermistor TH includes an element having negative temperaturecoefficient (NTC) characteristics or positive temperature coefficient(PTC) characteristics, that is, an element having a correlation betweenan electric resistance value and a temperature, and the like. Thethermistor TH is arranged in the vicinity of the power supply 12 so asto be capable of detecting a temperature of the power supply 12.

The PC1 pin of the MCU 50 is connected to a node N32 provided betweenthe resistor R9 and the thermistor TH in the thermistor circuit C2. Whenthe thermistor circuit C2 is in the conductive state (that is, when theswitch SW2 is on), a voltage divided by the resistor R9 and thethermistor TH is input to the PC1 pin. The MCU 50 can detect atemperature of the thermistor TH, that is, the temperature of the powersupply 12, based on a voltage value input to the PC1 pin.

The PA8 pin of the MCU 50 is a pin that is connected to the switch SW2and outputs the ON command to turn on the switch SW2 or outputs the OFFcommand to turn off the switch SW2. The MCU 50 can turn on the switchSW2 and brought the thermistor circuit C2 into the conductive state byoutputting the ON command from the PA8 pin. The MCU 50 can turn off theswitch SW2 and brought the thermistor circuit C2 into a non-conductivestate by outputting the OFF command from the PA8 pin. As a specificexample, when the switch SW2 is the switch configured by the MOSFET, thePA8 pin of the MCU 50 is connected to a gate terminal of the MOSFET. TheMCU 50 can control on and off of the switch SW2 by controlling a gatevoltage applied to the gate terminal (that is, output from the PA8 pin).

On the power supply line 60E, a switch SW3 is provided before thepositive electrode side terminal 47 a of the vibrator 47. Here, theswitch SW3 is, for example, a switch configured by a MOSFET. The switchSW3 is connected to the MCU 50. The switch SW3 is turned on in responseto the ON command of the MCU 50, and is turned off in response to theOFF command of the MCU 50.

Specifically, the PC6 pin of the MCU 50 is a pin that is connected tothe switch SW3 and outputs the ON command to turn on the switch SW3 oroutputs the OFF command to turn off the switch SW3. By outputting the ONcommand from the PC6 pin, the MCU 50 can turn on the switch SW3, supplypower to the vibrator 47 through the power supply line 60E, and thuscause the vibrator 47 to vibrate. By outputting the OFF command from thePC6 pin, the MCU 50 can turn off the switch SW3 and stop the powersupplied to the vibrator 47 through the power supply line 60E (that is,stop the vibration of the vibrator 47). As a specific example, when theswitch SW3 is the switch configured by the MOSFET, the PC6 pin of theMCU 50 is connected to a gate terminal of the MOSFET. The MCU 50 cancontrol on and off of the switch SW3 by controlling a gate voltageapplied to the gate terminal (that is, output from the PC6 pin).

A Zener diode D is connected to the power supply line 60E. Specifically,one anode side end of the Zener diode D is connected to the ground line60N, while the other cathode side end of the Zener diode D is connectedto a node N41 provided on the power supply line 60E. Here, the node N41is provided between the switch SW3 and the positive electrode sideterminal 47 a on the power supply line 60E. As a result, even when acounter electromotive force is generated from the vibrator 47 due to onand off of the vibrator 47, a current due to the counter electromotiveforce can be caused to flow through a closed circuit formed by thevibrator 47 and the Zener diode D as indicated by an arrow C3 in thedrawing. Therefore, the current due to the counter electromotive forcecan be prevented from flowing to outside of the closed circuit formed bythe vibrator 47 and the Zener diode D, and electronic components of thepower supply unit 10 such as the power supply 12 and the LDO regulator62 provided outside the closed circuit can thus be protected.

Further, a capacitor CD9 may be connected to the power supply line 60E.Specifically, in this case, one end of the capacitor CD9 is connected toa node N42 provided on the power supply line 60E, while the other endthereof is connected to the ground line 60N. Here, the node N42 isprovided closer to the positive electrode side terminal 47 a as comparedwith the node N41 on the power supply line 60E. In this way, thecapacitor CD9 can be arranged in the above-described closed circuitformed by the vibrator 47 and the Zener diode D, and the capacitor CD9can also protect the electronic components of the power supply unit 10such as the power supply 12 and the LDO regulator 62 provided outsidethe closed circuit formed by the vibrator 47 and the Zener diode D. Thecapacitor CD9 may be provided in the vicinity of the closed circuitinstead of being provided in the closed circuit described above. As aspecific example, the capacitor CD9 may be provided between the switchSW3 and the Zener diode D. In this case, the capacitor CD9 and the Zenerdiode D can still protect the electronic components of the power supplyunit 10 such as the power supply 12 and the LDO regulator 62.

The PB3 pin of the MCU 50 is a pin that is connected to the EN pin ofthe first DC/DC converter 63 and outputs a predetermined voltage signal.The MCU 50 can turn on and off an operation of the first DC/DC converter63 based on the voltage signal output from the PB3 pin. Specifically,the MCU 50 can operate the first DC/DC converter 63 (that is, enable thefirst DC/DC converter 63) by outputting a high-level voltage signal fromthe PB3 pin. The MCU 50 can also stop the operation of the first DC/DCconverter 63 (that is, disable the first DC/DC converter 63) byoutputting a low-level voltage signal from the PB3 pin.

The PB4 pin of the MCU 50 is a pin that is connected to the switch SW4(to be described later below) provided between the first DC/DC converter63 and the discharge terminal 41. The PB4 pin outputs an ON command toturn on the switch SW4 or outputs an OFF command to turn off the switchSW4. The MCU 50 can supply power to the load 21, as will be describedlater below, by outputting the ON command from the PB4 pin to turn onthe switch SW4. The MCU 50 can stop the supply of power to the load 21by outputting the OFF command from the PB4 pin to turn off the switchSW4. As a specific example, when the switch SW4 is the switch configuredby the MOSFET, the PB4 pin of the MCU 50 is connected to a gate terminalof the MOSFET. The MCU 50 can control on and off of the switch SW4 bycontrolling a gate voltage applied to the gate terminal (that is, outputfrom the PB4 pin).

As described above, the PB15 pin of the MCU 50 is a pin that isconnected to the CHG pin of the charging IC 55 and receives input of thecharging state information and the remaining capacity information outputby the charging IC 55.

The PA0 pin of the MCU 50 is a pin that is connected to the switch SW1of the LED circuit C1. The PA0 pin outputs an ON command to turn on theswitch SW1 or outputs an OFF command to turn off the switch SW1. As aspecific example, when the switch SW1 is the switch configured by theMOSFET, the PA0 pin of the MCU 50 is connected to a gate terminal of theMOSFET. The MCU 50 can control on and off of the switch SW1 bycontrolling a gate voltage applied to the gate terminal (that is, outputfrom the PA0 pin). The MCU 50 can bring the LED circuit C1 into theconductive state and cause the LED 70 to emit light (become lighted) byoutputting the ON command from the PA0 pin to turn on the switch SW1.The MCU 50 can bring the LED circuit C1 into a non-conductive state andextinguish the LED 70 by outputting the OFF command from the PA0 pin toturn off the switch SW1. The MCU 50 can switch the LED circuit C1between the conductive state and the non-conductive state at a highspeed and blink the LED 70 by outputting the ON command and the OFFcommand from the PA0 pin while switching the ON command and the OFFcommand at a high speed.

The PC5 pin of the MCU 50 is a pin that is connected to the OUT pin ofthe intake sensor 15 and receives output of the intake sensor 15 (thatis, a signal indicating a detection result of the intake sensor 15).

The PA11 pin and the PA12 pin of the MCU 50 are pins used to input andoutput signals for communication between the power supply unit 10 andthe external device. Specifically, as described above, the PA11 pin isconnected to the A7 pin and the B7 pin of the charge terminal 43 via theresistor R2, and is used to input and output the Dn side signal. Asdescribed above, the PA12 pin is connected to the A6 pin and the B6 pinof the charge terminal 43 via the resistor R1, and is used to input andoutput the Dp side signal.

The PC12 pin of the MCU 50 is a pin that is connected to the EN pin ofthe second DC/DC converter 64 and outputs a predetermined voltagesignal. The MCU 50 can turn on and off an operation of the second DC/DCconverter 64 based on the voltage signal output from the PC12 pin.Specifically, the MCU 50 can operate the second DC/DC converter 64 (thatis, enable the second DC/DC converter 64) by outputting a high-levelvoltage signal from the PC12 pin. The MCU 50 can also stop the operationof the second DC/DC converter 64 (that is, disable the second DC/DCconverter 64) by outputting a low-level voltage signal from the PC12pin.

The PB8 pin and the PB9 pin of the MCU 50 are pins used to output asignal for communication between the MCU 50 and another IC, and are usedfor communication between the MCU 50 and the display driver 65 in thepresent embodiment. Specifically, in the present embodiment, the MCU 50and the display driver 65 perform inter-integrated circuit (I2C)communication. The PB8 pin is used to output an SCL side signal of theI2C communication, while the PB9 pin is used to output an SDA sidesignal of the I2C communication. The MCU 50 can control the displaydriver 65 by signals output from PB8 pin and PB9 pin, and thus controldisplay contents of the display device 16.

As described above, the VCC pin of the intake sensor 15 is the positiveelectrode side power supply pin of the intake sensor 15, and isconnected to the power supply line 60E. The GND pin of the intake sensor15 is a ground pin of the intake sensor 15, and is connected to theground line 60N. As a result, the low-voltage system voltage output fromthe LDO regulator 62 is supplied to the intake sensor 15 via the powersupply line 60E.

As described above, the OUT pin of the intake sensor 15 is the pin fromwhich the signal indicating the detection result of the intake sensor 15is output, and is connected to the PC5 pin of the MCU 50. As a result,the intake sensor 15 can notify the MCU 50 of the detection result.

As described above, the VIN pin of the first DC/DC converter 63 is thepositive electrode side power supply pin of the first DC/DC converter63, and is connected to the power supply line 60D. The VIN pin of thefirst DC/DC converter 63 is also connected to the SW pin (switch pin) ofthe first DC/DC converter 63 via a coil CL1. The GND pin of the firstDC/DC converter 63 is a ground pin of the first DC/DC converter 63, andis connected to the ground line 60N.

The VOUT pin of the first DC/DC converter 63 is a pin from which thefirst high-voltage system voltage generated by the first DC/DC converter63 is output, and is connected to a positive electrode side dischargeterminal 41 a of the discharge terminal 41 via a power supply line 60F.A negative electrode side discharge terminal 41 b of the dischargeterminal 41 is connected to the ground line 60N.

The power supply line 60F is provided with the switch SW4. The switchSW4 is, for example, a switch configured by a MOSFET or the like, andmore specifically, is a power MOSFET having a high switching speed. Theswitch SW4 is connected to the MCU 50 as described above. The switch SW4is turned on in response to the ON command of the MCU 50, and is turnedoff in response to the OFF command of the MCU 50. When the switch SW4 isturned on, the power supply line 60F is brought into a conductive state,and the first high-voltage system voltage is supplied to the load 21 viathe power supply line 60F.

A varistor VR4 is connected to the power supply line 60F. Specifically,one end of the varistor VR4 is connected to a node N51 provided on thepower supply line 60F, while the other end is connected to the groundline 60N. Here, the node N51 is provided closer to the positiveelectrode side discharge terminal 41 a as compared with the switch SW4on the power supply line 60F, that is, on an output side of the switchSW4. In other words, the varistor VR4 is connected between the dischargeterminal 41 and the power supply 12, more specifically, between thedischarge terminal 41 and the first DC/DC converter 63 (morespecifically, the switch SW4).

Therefore, for example, even when static electricity is generated in thedischarge terminal 41 due to friction between the discharge terminal 41and the load 21 at the time of replacement of the first cartridge 20 orthe like, the static electricity can be released to the ground line 60Nvia the varistor VR4 so as to protect the switch SW4, the first DC/DCconverter 63, the power supply 12, and the like. Further, even if thevaristor VR4 breaks down, the switch SW4 and the first DC/DC converter63 can serve as a barrier against noise (in this case, the staticelectricity generated in the discharge terminal 41) for other elements(for example, the charging IC 55) located closer to the power supply 12than the switch SW4 and the first DC/DC converter 63, and can protectthe other elements.

A capacitor CD10 functioning as a decoupling capacitor is connected tothe power supply line 60F. Specifically, one end of the capacitor CD10is connected to a node N52 provided on the power supply line 60F, whilethe other end thereof is connected to the ground line 60N. Here, thenode N52 is provided between the node N51 and the switch SW4 on thepower supply line 60F. As a result, power supply from the switch SW4 tothe load 21 can be stabilized. Even if the static electricity isgenerated in the discharge terminal 41, the capacitor CD10 can beprotected from the static electricity by the varistor VR4.

Further, a capacitor CD11 functioning as a decoupling capacitor may beconnected to the power supply line 60F. Specifically, in this case, oneend of the capacitor CD11 is connected to a node N53 provided on thepower supply line 60F, while the other end thereof is connected to theground line 60N. Here, the node N53 is provided closer to the firstDC/DC converter 63 as compared with the switch SW4 on the power supplyline 60F. In other words, the capacitor CD11 is connected to an outputside of the first DC/DC converter 63. As a result, power supply from thefirst DC/DC converter 63 to the switch SW4 (for example, the powerMOSFET) can be stabilized. As a result, power supply to the load 21 canbe stabilized.

As described above, the EN pin of the first DC/DC converter 63 is a pinconfigured to set on and off of an operation of the first DC/DCconverter 63, and is connected to the PB3 pin of the MCU 50.

The MODE pin of the first DC/DC converter 63 is a pin configured to setan operation mode of the first DC/DC converter 63. The first DC/DCconverter 63 is, for example, a switching regulator, and can have apulse width modulation mode and a pulse frequency modulation mode asoperation modes. In the present embodiment, by connecting the MODE pinto the power supply line 60D, a high-level voltage is input to the MODEpin when the first DC/DC converter 63 can operate, and the first DC/DCconverter 63 is set to operate in the pulse width modulation mode.

As described above, the VIN pin of the second DC/DC converter 64 is thepositive electrode side power supply pin of the second DC/DC converter64, and is connected to the power supply line 60D. The VIN pin of thesecond DC/DC converter 64 is also connected to the SW pin (switch pin)of the second DC/DC converter 64 via a coil CL2. The GND pin of thesecond DC/DC converter 64 is a ground pin of the second DC/DC converter64 and is connected to the ground line 60N.

The VOUT pin of the second DC/DC converter 64 is a pin from which thesecond high-voltage system voltage generated by the second DC/DCconverter 64 is output, and is connected to the VCC_C pin of the displaydriver 65 via a power supply line 60G. As a result, the second DC/DCconverter 64 can supply the second high-voltage system voltage to thedisplay driver 65.

A varistor VR5 is connected to the power supply line 60G. Specifically,one end of the varistor VR5 is connected to a node N61 provided on thepower supply line 60G, while the other end is connected to the groundline 60N. Therefore, even when static electricity is generated in thedisplay device 16 since the display device 16 exposed to outside of theaerosol inhaler 1 is rubbed against any object and the staticelectricity flows back toward the second DC/DC converter 64 via the OLEDpanel 46 and the display driver 65, the static electricity can bereleased to the ground line 60N via the varistor VR5, and the secondDC/DC converter 64 and the like can be protected from the staticelectricity.

Similarly, a varistor VR6 is also connected to the power supply line60E. Specifically, one end of the varistor VR6 is connected to a nodeN43 provided on the power supply line 60E, while the other end isconnected to the ground line 60N. Here, the node N43 is provided betweenthe LDO regulator 62 and the switch SW3 on the power supply line 60E.Therefore, even when static electricity is generated in the displaydevice 16 since the display device 16 exposed to outside of the aerosolinhaler 1 is rubbed against any object and the static electricity flowsback toward the LDO regulator 62 via the OLED panel 46 and the displaydriver 65, the static electricity can be released to the ground line 60Nvia the varistor VR6, and the LDO regulator 62 can be protected from thestatic electricity.

A capacitor CD12 functioning as a decoupling capacitor is connected tothe power supply line 60G. Specifically, one end of the capacitor CD12is connected to a node N62 provided on the power supply line 60G, whilethe other end thereof is connected to the ground line 60N. Here, thenode N62 is provided closer to the second DC/DC converter 64 as comparedwith the node N61 on the power supply line 60G. As a result, the secondhigh-voltage system voltage can be stably supplied to the display driver65. Even if static electricity is generated in the display device 16,the capacitor CD12 can be protected from the static electricity by thevaristor VR5. That is, by providing the node N62 which is closer to thesecond DC/DC converter as compared with the node N61 on the power supplyline 60G, the display driver 65 can be protected from overvoltage whilestable operation of the display driver 65 can be achieved.

The EN pin of the second DC/DC converter 64 is a pin configured to seton and off of an operation of the second DC/DC converter 64, and isconnected to the PC12 pin of the MCU 50 as described above.

As described above, the VDD pin of the display driver 65 is the positiveelectrode side power supply pin of the display driver 65, and isconnected to the power supply line 60E. The VSS pin of the displaydriver 65 is a negative electrode side power supply pin of the displaydriver 65, and is connected to the ground line 60N. As a result, thelow-voltage system voltage output from the LDO regulator 62 is suppliedto the display driver 65 via the power supply line 60E. The low-voltagesystem voltage supplied to the display driver 65 is used as a powersource for operating the display driver 65.

The VCC_C pin of the display driver 65 is a pin that receives the secondhigh-voltage system voltage, and is connected to the VOUT pin of thesecond DC/DC converter 64 via the power supply line 60G as describedabove. When the display driver 65 receives the second high-voltagesystem voltage by the VCC_C pin, the received second high-voltage systemvoltage is supplied to the OLED panel 46 via a power supply line 60H. Asa result, the display driver 65 can cause the OLED panel 46 to operate.The display driver 65 and the OLED panel 46 may also be connected byanother line (not shown). The OLED panel 46 is an example of a load inthe present invention.

The SCL pin of the display driver 65 is a pin that receives the SCL sidesignal of the I2C communication between the MCU 50 and the displaydriver 65, and is connected to the PB8 pin of the MCU 50 as describedabove. The SDA pin of the display driver 65 is a pin that receives theSDA side signal of the I2C communication between the MCU 50 and thedisplay driver 65, and is connected to the PB9 pin of the MCU 50 asdescribed above.

The IXS pin of the display driver 65 is a pin configured to set whetherto perform the I2C communication or serial peripheral interface (SPI)communication for communication between the display driver 65 andanother IC (MCU 50 in the present embodiment). In the presentembodiment, by connecting the IXS pin to the power supply line 60E, ahigh-level voltage is input to the IXS pin, and the communicationbetween the display driver 65 and the MCU 50 is set to be performed bythe I2C communication. The communication between the display driver 65and the MCU 50 may be performed by the SPI communication upon alow-level voltage is input to the IXS pin.

MCU

Next, a configuration of the MCU 50 will be described in detail withreference to FIG. 5.

As shown in FIG. 5, the MCU 50 includes, as functional blocksimplemented by a processor executing programs stored in a ROM (notshown), an aerosol generation request detection unit 51, a temperaturedetection unit 52, a power control unit 53, and a notification controlunit 54.

The aerosol generation request detection unit 51 detects an aerosolgeneration request based on an output result of the intake sensor 15.The intake sensor 15 is configured to output a value of a pressure(internal pressure) change in the power supply unit 10 caused by inhaleof the user through the inhale port 32. The intake sensor 15 is, forexample, a pressure sensor that outputs an output value (for example, avoltage value or a current value) corresponding to internal pressurethat changes in accordance with a flow rate of air inhaled from an inlet(not shown) toward the inhale port 32 (that is, the puff operation ofthe user). The intake sensor 15 may be constituted by a condensermicrophone or the like. The intake sensor 15 may output an analog value,or may output a digital value converted from the analog value. Theintake sensor 15 may transmit the output to the aerosol generationrequest detection unit 51 through using the I2C communication or the SPIcommunication described above, or the like.

The temperature detection unit 52 detects the temperature of the powersupply 12 based on input from the thermistor circuit C2. Specifically,the temperature detection unit 52 applies a voltage to the thermistorcircuit C2 by turning on the switch SW2, and detects a temperature ofthe thermistor TH, that is, the temperature of the power supply 12 basedon a voltage value input from the thermistor circuit C2 to the MCU 50(for example, the PC1 pin) at that time.

The power control unit 53 controls supply of power to each electroniccomponent of the aerosol inhaler 1. For example, when the aerosolgeneration request detection unit 51 detects an aerosol generationrequest, the power control unit 53 operates the first DC/DC converter 63and controls switching of the switch SW4, thereby supplying power of thepower supply 12 to the load 21 via the positive electrode side dischargeterminal 41 a. As a result, the MCU 50 can supply power to the load 21,heat the load 21, and generate aerosol.

The power control unit 53 turns on the switch SW3 at predeterminedtiming so as to supply the standard system voltage to the vibrator 47via the positive electrode side terminal 47 a. As a result, the MCU 50can supply power of the standard system voltage to the vibrator 47 andcause the vibrator 47 to vibrate (function).

The power control unit 53 operates the second DC/DC converter 64 atpredetermined timing, thereby supplying the second high-voltage systemvoltage to the OLED panel 46 via the display driver 65. As a result, theMCU 50 can supply power of the second high-voltage system voltage to theOLED panel 46 and cause the OLED panel 46 to operate (function).

When power supply to the load 21 and power supply to the OLED panel 46are simultaneously performed, discharge from the power supply 12 at thattime may be a large current. The discharge of the large current mayimpose a large burden on the power supply 12, and thus lead todeterioration of the power supply 12. Therefore, it is desirable thatthe

MCU 50 stops the operation (that is, the function) of the OLED panel 46while the power is supplied to the load 21, that is, while the firstDC/DC converter 63 and the switch SW4 are operated.

Specifically, when input to the EN pin of the first DC/DC converter 63is at a high level, the MCU 50 sets input to the EN pin of the secondDC/DC converter 64 to a low level. As a result, when the first DC/DCconverter 63 and the switch SW4 are operated, an operation of the secondDC/DC converter 64 is stopped, so that the power supply to the OLEDpanel 46 can be stopped and thus the operation (that is, the function)of the OLED panel 46 can be stopped.

In this way, by preventing the power supply to the load 21 and the powersupply to the OLED panel 46 from being performed at the same time, thelarge current discharge from the power supply 12 can be prevented, andthus the deterioration of the power supply 12 caused by the largecurrent discharge can be prevented.

While the power is supplied to the load 21, that is, while the firstDC/DC converter 63 and the switch SW4 are operated, the power suppliedto the first DC/DC converter 63 can be prevented from becoming unstable(for example, becoming insufficient) by stopping the power supply to theOLED panel 46. As a result, the power supplied to the load 21 can bestabilized, and thus a decrease in fragrance in the aerosol inhaler 1caused by a variation in an amount of the aerosol generated by the load21 due to unstable power supply to the load 21 can be prevented.

When the aerosol generation request detection unit 51 detects an aerosolgeneration request, the power control unit 53 further turns on theswitch SW1 to bring the LED circuit C1 into the conductive state, andcauses the LED 70 to emit light (function). In this case, a voltageobtained by lowering the standard system voltage from the charging IC 55by the resistor R8 is supplied to a connector 70 a. That is, by turningon the switch SW1, the power control unit 53 can supply power of thevoltage obtained by lowering the standard system voltage by the resistorR8 to the LED 70 via the connector 70 a.

For example, the power control unit 53 performs control such that thepower supplied to the LED 70 is smaller than power supplied to otherelectronic components such as the load 21, the OLED panel 46, and thevibrator 47. That is, the power control unit 53 performs control suchthat the power supplied to the connector 70 a is smaller than powersupplied to the positive electrode side discharge terminal 41 a, thepositive electrode side terminal 47 a, and the like. As a result, it ispossible to supply appropriate power to the LED 70 with a simpleconfiguration, and thus high functionality of the aerosol inhaler 1 canbe achieved while an increase in a manufacturing cost of the aerosolinhaler 1 (for example, the power supply unit 10) is prevented.

The notification control unit 54 controls the notification unit 45 tonotify various types of information. For example, the notificationcontrol unit 54 controls the notification unit 45 to notify replacementtiming of the second cartridge 30 in response to detection of thereplacement timing of the second cartridge 30. The notification controlunit 54 detects and notifies the replacement timing of the secondcartridge 30 based on the cumulative number of times of puff operationsor cumulative time of energization to the load 21 stored in the memory19. The notification control unit 54 is not limited to only notify thereplacement timing of the second cartridge 30, and may also notifyreplacement timing of the first cartridge 20, replacement timing of thepower supply 12, charging timing of the power supply 12 and the like. Inaddition to or instead of these, the notification control unit 54 maynotify a remaining amount of the first cartridge 20, a remaining amountof the second cartridge 30, a remaining amount of the power supply 12,and the like.

In a state where one brand-new second cartridge 30 is set, when the puffoperation is performed a predetermined number of times or when thecumulative time of energization to the load 21 reaches a predeterminedvalue (for example, 120 seconds) due to the puff operation, thenotification control unit 54 may determine that the second cartridge 30has been used up (that is, a remaining amount is zero or empty), andnotify the replacement timing of the second cartridge 30.

When it is determined that all the second cartridges 30 included in theabove one set have been used up, the notification control unit 54 maydetermine that one first cartridge 20 included in the one set has beenused up (that is, the remaining amount is zero or empty) and notify thereplacement timing of the first cartridge 20.

Difference Between First DC/DC Converter and Second DC/DC Converter

Next, a difference between the first DC/DC converter 63 and the secondDC/DC converter 64 will be described with reference to FIG. 6.

The first DC/DC converter 63 boosts the input standard system voltage(for example, the output voltage of the power supply 12) to the firsthigh-voltage system voltage, and outputs power required by the load 21.The second DC/DC converter 64 boosts the input standard system voltageto the second high-voltage system voltage, and outputs power required bythe OLED panel 46.

An output voltage of the first DC/DC converter 63 is 4.0 to 4.5 [V]. Anoutput voltage of the second DC/DC converter 64 is 10 to 15 [V].Therefore, the output voltage of the first DC/DC converter 63 is lowerthan the output voltage of the second DC/DC converter 64. The outputvoltage of the first DC/DC converter 63 and the output voltage of thesecond DC/DC converter 64 are set in accordance with voltages requiredby the load 21 and the OLED panel 46, which are output destinations ofthe first DC/DC converter 63 and the second DC/DC converter 64,respectively.

An output current of the first DC/DC converter 63 is 1 [A] or more. Anoutput current of the second DC/DC converter 64 is 0.01 [A] or less.Therefore, the output current of the first DC/DC converter 63 is largerthan the output current of the second DC/DC converter 64. The outputcurrent of the first DC/DC converter 63 and the output current of thesecond DC/DC converter 64 are set in accordance with the power (current)required by the load 21 and the OLED panel 46, which are the outputdestinations of the first DC/DC converter 63 and the second DC/DCconverter 64, respectively.

As described above, the OLED panel 46 has lower power consumption(current consumption) than the load 21. As compared with the first DC/DCconverter 63, the second DC/DC converter 64 preferably has a smallersize and a smaller mounting area than efficiency improvement.

A switching frequency of the first DC/DC converter 63 is 1.00 [MHz]. Aswitching frequency of the second DC/DC converter 64 is higher than 1.00[MHz]. Therefore, the switching frequency of the first DC/DC converter63 is lower than the switching frequency of the second DC/DC converter64. In principle of a switching regulator of a DC/DC converter, acurrent flowing through an inductor becomes lower as a switching cyclebecomes shorter, that is, as a switching frequency becomes higher, sothat a size of the inductor can be reduced. In principle of theswitching regulator of the DC/DC converter, a ripple of a waveformsubjected to voltage conversion due to switching becomes smaller as theswitching cycle becomes shorter, that is, as the switching frequencybecomes higher, so that a size of a capacitor that smoothens the ripplecan be reduced. Since the switching frequency of the second DC/DCconverter 64 is higher than that of the first DC/DC converter 63, a sizeof an inductor of the second DC/DC converter 64 can be reduced. The sizeof the inductor of the second DC/DC converter 64 is smaller than a sizeof an inductor of the first DC/DC converter 63.

Meanwhile, in principle of the switching regulator of the DC/DCconverter, a loss generated when a state of a switch transitions betweenon and off becomes smaller as the switching cycle becomes longer, thatis, as the switching frequency becomes lower. Therefore, conversionefficiency, which is a ratio of power output from the VOUT to powerinput to the VIN pin, is improved. Conversion efficiency of the firstDC/DC converter 63 is 90 [%] or more. Conversion efficiency of thesecond DC/DC converter 64 is less than 90 [%]. The conversion efficiencyof the first DC/DC converter 63 is higher than the conversion efficiencyof the second DC/DC converter 64.

As described above, the first DC/DC converter 63 whose outputdestination has large power consumption (current consumption) maintainshigh conversion efficiency by reducing the switching frequency, whilethe second DC/DC converter 64 whose output destination has small powerconsumption (current consumption) has higher switching frequency and isreduced in size, so that a size of the power supply unit 10 can bereduced.

When a signal indicating that the puff operation has been detected isinput from the intake sensor 15 to the PC5 pin, that is, when the puffoperation of the user is detected, the MCU 50 activates the first DC/DCconverter 63. When it is detected that the operation unit 18 is operatedby the user, the MCU 50 activates the second DC/DC converter 64. Asdescribed above, a condition under which the MCU 50 activates the firstDC/DC converter 63 is different from a condition under which the MCU 50activates the second DC/DC converter 64. As a result, the first DC/DCconverter 63 and the second DC/DC converter 64 are less likely tosimultaneously function, so that an influence of heat and switchingnoise generated from one of the DC/DC converters among the first DC/DCconverter 63 and the second DC/DC converter 64 on the other DC/DCconverter can be reduced.

The MCU 50 stops the function of the first DC/DC converter 63 when asignal indicating an end of the puff operation is input from the intakesensor 15 to the PC5 pin, that is, when the end of the puff operation ofthe user is detected, or when a continuous energization upper limit timehas elapses since the activation of the first DC/DC converter 63. TheMCU 50 stops the function of the second DC/DC converter 64 when apredetermined time has elapsed since the activation of the second DC/DCconverter 64, or when it is detected that the operation unit 18 isoperated again by the user within a predetermined time since theactivation of the second DC/DC converter 64. As described above, acondition under which the MCU 50 stops the function of the first DC/DCconverter 63 is different from a condition under which the MCU 50 stopsthe function of the second DC/DC converter 64. As a result, the firstDC/DC converter 63 and the second DC/DC converter 64 are less likely tosimultaneously function, so that the influence of the heat and theswitching noise generated from one of the DC/DC converters among thefirst DC/DC converter 63 and the second DC/DC converter 64 on the otherDC/DC converter can be reduced.

The MCU 50 may be configured to perform control such that the firstDC/DC converter 63 and the second DC/DC converter 64 do not function atthe same time. As a result, the influence of the heat and the switchingnoise generated from one of the DC/DC converters among the first DC/DCconverter 63 and the second DC/DC converter 64 on the other DC/DCconverter can be more reliably reduced.

The MCU 50 may be configured to perform control such that the firstDC/DC converter 63 and the second DC/DC converter 64 do not functionsimultaneously with the charging IC 55. As a result, the influence ofthe heat and the switching noise generated from the first DC/DCconverter 63 and the second DC/DC converter 64 on the charging IC 55 canbe reduced.

Circuit Board

Next, the circuit board 60 on which a plurality of elements are mountedwill be described with reference to FIGS. 2 and 7 to 10. It should benoted that FIGS. 7 to 10 only show a main part of a circuitconfiguration of the circuit board 60.

As shown in FIG. 2, the circuit board 60 has a first surface 71 and asecond surface 72 which is located on a side opposite from the firstsurface 71. The first surface 71 and the second surface 72 are surfacessubstantially perpendicular to the left-right direction. The firstsurface 71 forms a right surface of the circuit board 60, while thesecond surface 72 forms a left surface of the circuit board 60. Thesecond surface 72 faces the power supply 12, and/or the second surface72 is arranged closer to the power supply 12 than the first surface 71.In the present embodiment, the second surface 72 faces the power supply12.

The plurality of elements are mounted on the first surface 71 whichforms the right surface of the circuit board 60 and the second surface72 which forms the left surface of the circuit board 60.

As shown in FIGS. 7 to 10, the circuit board 60 further includes aground layer 73 and a power supply layer 74. The ground layer 73 and thepower supply layer 74 are provided between the first surface 71 and thesecond surface 72. That is, in the present embodiment, the circuit board60 is a four-layer multilayer board formed by laminating the firstsurface 71, the ground layer 73, the power supply layer 74, and thesecond surface 72.

In the present embodiment, the circuit board 60 is formed by laminatingthe first surface 71, the ground layer 73, the power supply layer 74,and the second surface 72 in this order from the right. The circuitboard 60 may also be a multilayer board having five or more layers inwhich at least one of the first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 is furthermultilayered. In the circuit board 60, the first surface 71, the groundlayer 73, the power supply layer 74, and the second surface 72 may bedivided into two or more groups or may be laminated only in the samegroup. In this case, it should be noted that although the circuit board60 is physically divided into two groups, the order in which the firstsurface 71, the ground layer 73, the power supply layer 74, and thesecond surface 72 are arranged in the left-right direction is notchanged.

The circuit board 60 has a substantially L shape as a whole when viewedin the left-right direction which is substantially perpendicular to thefirst surface 71 and the second surface 72 on which the plurality ofelements are mounted. Specifically, the circuit board 60 includes aconnection portion 600 which has a substantially quadrangular shape asviewed in the left-right direction, a first portion 601 which extendsforward from a front end surface of the connection portion 600, and asecond portion 602 which extends upward from an upper end surface of theconnection portion 600. The first surface 71, the ground layer 73, thepower supply layer 74, and the second surface 72 have substantially thesame shape, and are substantially L-shaped as viewed in the left-rightdirection. Specifically, the first surface 71 includes a connectionportion 710 which has a substantially quadrangular shape as viewed inthe left-right direction, a first portion 711 which extends forward froma front end portion of the connection portion 710, and a second portion712 which extends upward from an upper end surface of the connectionportion 710. The second surface 72 includes a connection portion 720which has a substantially quadrangular shape as viewed in the left-rightdirection, a first portion 721 which extends forward from a front endportion of the connection portion 720, and a second portion 722 whichextends upward from an upper end surface of the connection portion 720.The ground layer 73 includes a connection portion 730 which has asubstantially quadrangular shape as viewed in the left-right direction,a first portion 731 which extends forward from a front end portion ofthe connection portion 730, and a second portion 732 which extendsupward from an upper end surface of the connection portion 730. Thepower supply layer 74 includes a connection portion 740 which has asubstantially quadrangular shape as viewed in the left-right direction,a first portion 741 which extends forward from a front end portion ofthe connection portion 740, and a second portion 742 which extendsupward from an upper end surface of the connection portion 740. Theconnection portion 600 of the circuit board 60 is formed by theconnection portions 710, 720, 730, and 740 of the first surface 71, theground layer 73, the power supply layer 74, and the second surface 72.The first portion 601 of the circuit board 60 is formed by the firstportions 711, 721, 731, and 741 of the first surface 71, the groundlayer 73, the power supply layer 74, and the second surface 72. Thesecond portion 602 is formed by the second portions 712, 722, 732, and742 of the first surface 71, the ground layer 73, the power supply layer74, and the second surface 72.

As shown in FIG. 7, elements of the display driver 65, the second DC/DCconverter 64, the MCU 50, the charging IC 55, the LDO regulator 62, theprotection IC 61, the first DC/DC converter 63, and a power supplyconnector 81 are mounted on the first surface 71 of the circuit board60. Further, an intake sensor connection portion 82, a switch connectionportion 83, and a vibrator connection portion 84 are formed on the firstsurface 71 of the circuit board 60.

The display driver 65 is mounted above an up-down direction center ofthe second portion 712. The OLED panel 46 is arranged above the circuitboard 60. The display driver 65 and the OLED panel 46 are connected by apower supply line 60H.

The second DC/DC converter 64 is mounted slightly above the up-downdirection center of the second portion 712 and is located in front ofand below the display driver 65.

The MCU 50 is mounted at a position straddling a lower end portion ofthe second portion 712 and an upper end portion of the connectionportion 710.

The charging IC 55 is mounted on a rear end portion of the first portion711.

As described above, the charging IC 55 is mounted on the first surface71 located on a side opposite from the second surface 72 which faces thepower supply 12 and/or is arranged in the vicinity of the power supply12. As a result, the power supply 12 can be prevented from being heatedby heat generated from the charging IC 55 during charging of the powersupply 12.

The LDO regulator 62 is mounted between the MCU 50 and the charging IC55 in the front-rear direction at a substantially central portion in theup-down direction of the connection portion 710.

As described above, the LDO regulator 62 is mounted on the first surface71 located on the side opposite from the second surface 72 which facesthe power supply 12 and/or is arranged in the vicinity of the powersupply 12. As a result, the power supply 12 can be prevented from beingheated by heat generated from the LDO regulator 62 during the chargingof the power supply 12.

The protection IC 61 is mounted at a position straddling the connectionportion 710 and the first portion 711 below the charging IC 55 and theLDO regulator 62.

The first DC/DC converter 63 is mounted on a front upper end portion ofthe first portion 711.

As described above, since the first DC/DC converter 63 is mounted on thefirst surface 71 located on the side opposite from the second surface 72which faces the power supply 12 and/or is arranged in the vicinity ofthe power supply 12, the power supply 12 can be prevented from beingheated by heat generated during functioning of the first DC/DC converter63.

The power supply connector 81 is a connector configured to electricallyconnect the circuit board 60 to the power supply 12, and is mounted on alower end portion of the first portion 711 below the first DC/DCconverter 63. A power line connected to the power supply 12 is connectedto the power supply connector 81.

The intake sensor connection portion 82 is formed at a substantiallycentral portion in the up-down direction of a front end portion of thesecond portion 712. A power line connected to the intake sensor 15 issoldered to the intake sensor connection portion 82.

The switch connection portion 83 is formed at a substantially centralportion in the up-down direction of a rear end portion of the secondportion 712. A power line connected to the operation unit 18 is solderedto the switch connection portion 83.

The vibrator connection portion 84 is formed at a rear lower end portionof the connection portion 710. Power lines connected to the positiveelectrode side terminal 47 a and the negative electrode side terminal 47b of the vibrator 47 are soldered to the vibrator connection portion 84.

Therefore, the first DC/DC converter 63 and the second DC/DC converter64 are mounted on the circuit board 60 so as to be spaced apart fromeach other. More specifically, the first DC/DC converter 63 is mountedon the first portion 601 of the circuit board 60, while the second DC/DCconverter 64 is mounted on the second portion 602 of the circuit board60. Further, the first DC/DC converter 63 is mounted on the firstportion 601 of the circuit board 60, the second DC/DC converter 64 ismounted on the second portion 602 of the circuit board 60, while the MCU50 is mounted at the position straddling the lower end portion of thesecond portion 712 of the circuit board 60 and the upper end portion ofthe connection portion 710. As a result, a linear distance between thefirst DC/DC converter 63 and the second DC/DC converter 64 is longerthan a linear distance between the first DC / DC converter 63 and theMCU 50, and is also longer than a linear distance between the secondDC/DC converter 64 and the MCU 50. The term “linear distance” as usedherein refers to a shortest distance between two objects connected by astraight line. The same also applies to the following description.

As described above, since the first DC/DC converter 63 and the secondDC/DC converter 64 are mounted on the circuit board 60 so as to bespaced apart from each other, the influence of the heat and theswitching noise generated from one of the DC/DC converters among thefirst DC/DC converter 63 and the second DC/DC converter 64 on the otherDC/DC converter can be reduced.

Since the first DC/DC converter 63 and the second DC/DC converter 64 areboth mounted on the first surface 71 of the circuit board 60, the firstDC/DC converter 63 and the second DC/DC converter 64 are arranged on thesame surface, so that the second surface 72 on which the first DC/DCconverter 63 and the second DC/DC converter 64 are not mounted is lesslikely to be influenced by the heat and the switching noise generatedfrom the DC/DC converters.

As shown in FIG. 10, the LED 70, the discharge terminal 41, a powermodule 85, the charge terminal 43, and the thermistor TH are mounted onthe second surface 72 of the circuit board 60.

The LED 70 is mounted on a substantially central portion in the up-downdirection of a rear end portion of the second portion 722.

The discharge terminal 41 is mounted so as to protrude upward from anupper end portion of the first portion 721. The discharge terminal 41 isa pin which is incorporated with a spring, and is connected to the load21 of the first cartridge 20. Power of the power supply 12 is suppliedfrom the discharge terminal 41 to the load 21.

The power module 85 is mounted on the first portion 721 below thedischarge terminal 41. The power module 85 includes the switch SW4, thecapacitor CD10, and the varistor VR4. It should be noted that the powermodule 85 only needs to include the switch SW4, and may not include thecapacitor CD10 and/or the varistor VR4. In this case, the capacitor CD10and/or the varistor VR4 which are not included in the power module 85are provided between the discharge terminal 41 and the power module 85.

The charge terminal 43 is mounted so as to protrude downward from alower end portion of the second surface 72 at a position straddling theconnection portion 720 and the first portion 721 in the front-reardirection.

Further, on the first surface 71 which is located on the side oppositefrom the second surface 72 as viewed in the left-right direction, atleast a portion of the protection IC 61 is mounted in a regionoverlapping the charge terminal 43 mounted on the second surface 72 (seeFIG. 7).

As a result, the elements can be mounted on the circuit board 60 at highdensity, and the circuit board 60 can be further downsized.

The thermistor TH is mounted in a region behind and below the connectionportion 720. Therefore, the thermistor TH is mounted on a rear lower endportion of the entire second surface 72.

Since the thermistor TH is mounted on the second surface 72 which facesthe power supply 12 and/or is arranged closer to the power supply 12than the first surface 71, the thermistor TH can be arranged to face thepower supply 12 and/or arranged closer to the power supply 12. As aresult, the temperature of the power supply 12 can be detected moreaccurately by the thermistor TH.

The thermistor circuit C2 is formed on the second surface 72 by thethermistor TH and the resistor R9. The resistor R9 is mounted on thesecond surface 72 in front of the thermistor TH. The thermistor TH isarranged apart from the resistor R9. At least one of the plurality ofelements is mounted at a position where a linear distance from theresistor R9 to the at least one of the plurality of elements is shorterthan a linear distance from the resistor R9 to the thermistor TH. In thepresent embodiment, the switch SW2 is mounted at a position where alinear distance from the resistor R9 to the switch SW2 is shorter than alinear distance from the resistor R9 to the thermistor TH.

In this way, since the thermistor TH is mounted on the second surface 72so as to be spaced apart from the resistor R9, the thermistor TH is lesslikely to be influenced by heat generated from the resistor R9. As aresult, the temperature of the power supply 12 can be detected moreaccurately by the thermistor TH.

Since the thermistor TH is mounted on the second surface 72 which isdifferent from the first surface 71 on which the MCU 50 is mounted, thethermistor TH is less likely to be influenced by heat generated from theMCU 50. As a result, the temperature of the power supply 12 can bedetected more accurately by the thermistor TH.

Since the first DC/DC converter 63 is mounted on the first surface 71which is different from the second surface 72 on which the thermistor THis mounted, the thermistor TH is less likely to be influenced by heatgenerated from the first DC/DC converter 63. As a result, thetemperature of the power supply 12 can be detected more accurately bythe thermistor TH.

Since the LDO regulator 62 is mounted on the first surface 71 which isdifferent from the second surface 72 on which the thermistor TH ismounted, the thermistor TH is less likely to be influenced by heatgenerated from the LDO regulator 62. As a result, the temperature of thepower supply 12 can be detected more accurately by the thermistor TH.

Since the charging IC 55 is mounted on the first surface 71 which isdifferent from the second surface 72 on which the thermistor TH ismounted, the thermistor TH is less likely to be influenced by heatgenerated from the charging IC 55. As a result, the temperature of thepower supply 12 can be detected more accurately by the thermistor TH.

Both the first DC/DC converter 63 and the discharge terminal 41 which isconnected to the load 21 functioning by consuming power output from thefirst DC/DC converter 63 are mounted on the first portion 601 of thecircuit board 60. Further, the second DC/DC converter 64 and the displaydriver 65 which is connected to the OLED panel 46 functioning byconsuming power output from the second DC/DC converter 64 are mounted onthe second portion 602 of the circuit board 60.

The discharge terminal 41 is not necessarily mounted on the firstportion 601 of the circuit board 60, and may also be connected to thesecond portion 602 of the circuit board 60. Similarly, the displaydriver 65 is not necessarily mounted on the second portion 602 of thecircuit board 60, and may also be connected to the first portion 601 ofthe circuit board 60.

As described above, since the discharge terminal 41 is mounted on orconnected to the first portion 601 of the circuit board 60 while thedisplay driver 65 is mounted on or connected to the second portion 602of the circuit board 60, the discharge terminal 41 can be arranged closeto the first DC/DC converter 63 while the display driver 65 can bearranged close to the second DC/DC converter 64. Therefore, a path forsupplying the power boosted by the first DC/DC converter 63 to the load21 can be shortened, while a path for supplying the power boosted by thesecond DC/DC converter 64 to the OLED panel 46 can be shortened. As aresult, a loss of the power boosted by the first DC/DC converter 63 andthe second DC/DC converter 64 can be reduced. An influence on otherelements caused by the loss of the power boosted by the first DC/DCconverter 63 and the second DC/DC converter 64 can thus be reduced, anda decrease in an amount of aerosol that can be generated with a singletime of charging can be reduced.

The first DC/DC converter 63 is mounted on the first surface 71, whilethe power module 85 is mounted on the second surface 72. As describedabove, since the first DC/DC converter 63 and the power module 85 aremounted on different surfaces of the circuit board 60, heat generatedfrom the first DC/DC converter 63 and heat generated from the powermodule 85 when power is supplied to the load 21 can be prevented frombeing concentrated.

Since the power module 85 and the discharge terminal 41 are both mountedon the first portion 721 of the second surface 72, the power module 85and the discharge terminal 41 are mounted close to each other. As aresult, a length of a portion of the power supply line 60F thatelectrically connects the power module 85 and the discharge terminal 41can be reduced. A pulse wave flows through the portion of the powersupply line 60F that electrically connects the power module 85 and thedischarge terminal 41. Therefore, by shortening the length of theportion of the power supply line 60F that electrically connects thepower module 85 and the discharge terminal 41, an influence of the pulsewave on other elements can be reduced.

On the first surface 71 which is located on the side opposite from thesecond surface 72, no element is mounted in a region overlapping thethermistor TH mounted on the second surface 72 as viewed in theleft-right direction.

Therefore, the thermistor TH is less likely to be influenced by heatgenerated from each element mounted on the first surface 71 located onthe side opposite from the second surface 72. As a result, thetemperature of the power supply 12 can be detected more accurately bythe thermistor TH.

The second surface 72 has a high density region 72A in which a largenumber of elements are mounted and mounting density of the mountedelements is high, and a low density region 72B in which the mountingdensity of the mounted elements is lower than that of the high densityregion 72A. In the present embodiment, the first portion 721, an upperregion of the connection portion 720, and a region near an up-downdirection center of the connection portion 720 between the connectionportion 720 and the first portion 721 constitute the high-density region72A. In the present embodiment, the thermistor TH is mounted in a rearand lower region of the connection portion 720 which is a part of thelow density region 72B in which the mounting density of the mountedelements is lower than that of the high-density region 72A. In thepresent embodiment, in addition to the rear lower region of theconnection portion 720, a lower region of the second portion 722 and arear upper region of the second portion 722 constitute the low densityregion 72B.

Therefore, since the thermistor TH is mounted in the region where themounting density of the mounted elements is low, the thermistor TH isless likely to be influenced by heat generated from other elementsmounted on the circuit board 60. As a result, the temperature of thepower supply 12 can be detected more accurately by the thermistor TH.

As shown in FIG. 8, the ground line 60N is formed in the ground layer 73of the circuit board 60. In the present embodiment, the ground line 60Nis a conductive thin film formed on the ground layer 73 of the circuitboard 60, and has a reference potential of the circuit board 60.

The ground line 60N is not formed in a region overlapping the thermistorTH mounted on the second surface 72 as viewed in the left-rightdirection. Therefore, the thermistor TH is less likely to be influencedby heat generated from the ground line 60N. As a result, the temperatureof the power supply 12 can be detected more accurately by the thermistorTH.

The ground line 60N is not formed in a rear lower end region of theground layer 73 which includes a region overlapping the thermistor THmounted on the second surface 72 as viewed in the left-right direction.In other words, the ground line 60N has a shape obtained by cutting outthe rear lower end region of the ground layer 73 as viewed in theleft-right direction. Therefore, the ground line 60N is not formed inthe region overlapping the thermistor TH as viewed in the left-rightdirection, and does not surround the thermistor TH. Therefore, thethermistor TH is less likely to be influenced by heat generated from theground line 60N. As a result, the temperature of the power supply 12 canbe detected more accurately by the thermistor TH.

As shown in FIG. 9, a power supply path 743 that supplies power to eachelement mounted on the circuit board 60 is formed in the power supplylayer 74 of the circuit board 60. The power supply path 743 includes thepower supply lines 60A, 60B, 60C, 60D, 60E, 60G, and the like. The powersupply path 743 is a conductor circuit wiring formed in the power supplylayer 74 of the circuit board 60 by printing or the like.

The power supply path 743 is not formed in the region overlapping thethermistor TH mounted on the second surface 72 as viewed in theleft-right direction. Therefore, the thermistor TH is less likely to beinfluenced by heat generated from the power supply path 743. As aresult, the temperature of the power supply 12 can be detected moreaccurately by the thermistor TH.

The power supply path 743 is not formed in a rear lower end region ofthe power supply layer 74 which includes a region overlapping thethermistor TH mounted on the second surface 72 as viewed in theleft-right direction. Further, the power supply path 743 is formed so asnot to surround the thermistor TH as viewed in the left-right direction.

Therefore, the thermistor TH is less likely to be influenced by the heatgenerated from the power supply path 743. As a result, the temperatureof the power supply 12 can be detected more accurately by the thermistorTH.

As described above, the ground line 60N of the ground layer 73 and thepower supply path 743 of the power supply layer 74 are not formed in theregion overlapping the thermistor TH mounted on the second surface 72 asviewed in the left-right direction. Therefore, the thermistor TH is lesslikely to be influenced by the heat generated from the ground line 60Nand the power supply path 743. As a result, the temperature of the powersupply 12 can be detected more accurately by the thermistor TH.

Referring back to FIG. 2, the internal holder 13 holds the circuit board60 on a right side of the partition wall 13 d and holds the power supply12 on a left side of the partition wall 13 d. As described above, sincethe circuit board 60 and the power supply 12 are both held by theinternal holder 13, the thermistor TH can be maintained at a positionsuitable for detecting the temperature of the power supply 12.

It should be noted that the internal holder 13 may hold only a part ofthe circuit board 60 on the right side of the partition wall 13 d andhold only a part of the power supply 12 on the left side of thepartition wall 13 d. More specifically, the internal holder 13 may holdthe circuit board 60 and the power supply 12 such that positions of thethermistor TH and the power supply 12 facing the thermistor TH in theleft-right direction are exposed from the internal holder 13. In thiscase, since the temperature of the power supply 12 is transmitted to thethermistor TH without passing through the partition wall 13 d, thethermistor TH can detect the temperature of the power supply 12 moreaccurately at high speed.

Although the embodiment of the present invention is described above, thepresent invention is not limited to the above-described embodiment, andmodifications, improvements, and the like can be made as appropriate.

For example, although the first DC/DC converter 63 and the second DC/DCconverter 64 are both mounted on the first surface 71 of the circuitboard 60 in the present embodiment, a configuration in which the firstDC/DC converter 63 is mounted on the first surface 71 of the circuitboard 60 while the second DC/DC converter 64 is mounted on the secondsurface 72 of the circuit board 60 may also be employed. In this case,the first DC/DC converter 63 and the second DC/DC converter 64 aremounted on different surfaces, and can thus be arranged apart from eachother, so that the influence of the heat and the switching noisegenerated from one of the DC/DC converters among the first DC/DCconverter 63 and the second DC/DC converter 64 on the other DC/DCconverter can be reduced.

For example, although the ground layer 73 has substantially the sameshape as the first surface 71 and the second surface 72 as viewed in theleft-right direction in the present embodiment, the ground layer 73 mayhave a shape whose rear lower end region is cut out as compared with thefirst surface 71 and the second surface 72. In this case, the thermistorTH is less likely to be influenced by heat generated from the groundline 60N. As a result, the temperature of the power supply 12 can bedetected more accurately by the thermistor TH.

For example, although the power supply layer 74 has substantially thesame shape as the first surface 71 and the second surface 72 as viewedin the left-right direction in the present embodiment, the power supplylayer 74 may have a shape whose rear lower end region is cut out ascompared with the first surface 71 and the second surface 72. In thiscase, the thermistor TH is less likely to be influenced by the heatgenerated from the power supply path 743. As a result, the temperatureof the power supply 12 can be detected more accurately by the thermistorTH.

For example, although the temperature of the power supply 12 is acquiredby the thermistor TH in the present embodiment, the temperature of thepower supply 12 may be acquired by any temperature sensor as desiredwithout being limited to the thermistor TH.

For example, although the circuit board 60 is configured by theconnection portion 600, the first portion 601, and the second portion602, and the entire circuit board 60 substantially has an L shape in thepresent embodiment, a configuration in which a part of the circuit board60 has the substantially L shape formed by the connection portion 600,the first portion 601, and the second portion 602 may also be employed.

For example, although the circuit board 60 and the power supply 12 arearranged inside the power supply unit case 11 so as to overlap eachother in the left-right direction in the present embodiment, the secondsurface 72 may be arranged closer to the power supply than the firstsurface 71. Therefore, the circuit board 60 and the power supply 12 maybe offset so as not to overlap with each other in the left-rightdirection and arranged inside the power source unit case 11.

In the present specification, at least the following matters aredescribed. Although corresponding constituent elements or the like inthe above embodiments are shown in parentheses, the present invention isnot limited thereto.

(1) A power supply unit (power supply unit 10) for an aerosol inhaler(aerosol inhaler 1) includes: a power supply (power supply 12)configured to supply power to a load (load 21) that atomizes an aerosolsource (aerosol source 22);

a temperature sensor (thermistor TH) configured to acquire a temperatureof the power supply;

a controller (MCU 50) configured to control at least one of charging ofthe power supply and discharging to the load based on an output of thetemperature sensor; and

a circuit board (circuit board 60) on which a plurality of elementsincluding the temperature sensor and the controller are mounted.

The circuit board includes: a first surface (first surface 71); a secondsurface (second surface 72) which is a reverse surface from the firstsurface or is located on a side opposite from the first surface; a powersupply layer (power supply layer 74) in which a power supply path (powersupply path 743) configured to supply power to the plurality of elementsis formed; and a ground layer (ground layer 73) in which a ground path(ground line 60N) configured to function as a ground of the plurality ofelements is formed.

The power supply layer and the ground layer are provided between thefirst surface and the second surface.

The temperature sensor is mounted on the second surface.

At least one of the power supply path and the ground path is not formedin a region which overlaps the temperature sensor as viewed from a firstdirection (left-right direction), the first direction being a directionin which the first surface and the second surface are opposed to eachother.

According to (1), since at least one of the power supply path and theground path is not formed in the region which overlaps the temperaturesensor as viewed from the first direction, the temperature sensor isless likely to be influenced by heat generated from the at least one ofthe power supply path and the ground path. As a result, the temperatureof the power supply can be detected more accurately by the temperaturesensor.

(2) The power supply unit for the aerosol inhaler according to (1), inwhich the power supply path and the ground path are not formed in theregion which overlaps the temperature sensor as viewed from the firstdirection.

According to (2), since the power supply path and the ground path arenot formed in the region which overlaps the temperature sensor as viewedfrom the first direction, the temperature sensor is less likely to beinfluenced by heat generated from both the power supply path and theground path. As a result, the temperature of the power supply can bedetected more accurately by the temperature sensor.

(3) The power supply unit for the aerosol inhaler according to (1) or(2), in which the ground path is not formed in the region which overlapsthe temperature sensor as viewed from the first direction, and is formedso as not to surround the temperature sensor.

According to (3), the ground path is not formed in the region whichoverlaps the temperature sensor as viewed from the first direction, andis formed so as not to surround the temperature sensor, so that thetemperature sensor is less likely to be influenced by the heat generatedfrom the ground path. As a result, the temperature of the power supplycan be detected more accurately by the temperature sensor.

(4) The power supply unit for the aerosol inhaler according to any oneof (1) to (3), in which the power supply path is not formed in theregion which overlaps the temperature sensor as viewed from the firstdirection, and is formed so as not to surround the temperature sensor.

According to (4), the power supply path is not formed in the regionwhich overlaps the temperature sensor as viewed from the firstdirection, and is formed so as not to surround the temperature sensor,so that the temperature sensor is less likely to be influenced by theheat generated from the power supply path. As a result, the temperatureof the power supply can be detected more accurately by the temperaturesensor.

(5) The power supply unit for the aerosol inhaler according to any oneof (1) to (4), in which the controller is mounted on the first surface.

According to (5), since the temperature sensor is mounted on the secondsurface which is different from the first surface on which thecontroller is mounted, the temperature sensor is less likely to beinfluenced by heat generated from the controller. As a result, thetemperature of the power supply can be detected more accurately by thetemperature sensor.

(6) The power supply unit for the aerosol inhaler according to any oneof (1) to (5), in which the temperature sensor includes a thermistor.

One of the plurality of elements is a resistor (resistor R9) mounted onthe second surface.

On the second surface, a voltage dividing circuit (thermistor circuitC2) is formed by the thermistor and the resistor.

At least one of the plurality of elements is mounted at a position wherea linear distance from the resistor to the at least one of the pluralityof elements is shorter than a linear distance from the resistor to thethermistor.

According to (6), since the temperature sensor includes the thermistor,and the thermistor is mounted on the second surface so as to be spacedapart from the resistor, the thermistor is less likely to be influencedby heat generated from the resistor. As a result, the temperature of thepower supply can be detected more accurately through using thethermistor.

(7) The power supply unit for the aerosol inhaler according to any oneof (1) to (6), in which the second surface includes a high densityregion (high density region 72A) in which mounting density of theplurality of elements is high, and a low density region (low densityregion 72B) in which the mounting density of the plurality of elementsis lower than that of the high density region.

The temperature sensor is mounted in the low density region.

According to (7), since the temperature sensor is mounted in the regionwhere the mounting density of the mounted elements is low, thetemperature sensor is less likely to be influenced by heat generatedfrom other elements mounted on the circuit board. As a result, thetemperature of the power supply can be detected more accurately by thetemperature sensor.

(8) The power supply unit for the aerosol inhaler according to any oneof (1) to (7), in which the elements are not mounted in the region ofthe first surface which overlaps the temperature sensor as viewed fromthe first direction.

According to (8), since no element is mounted on the first surface inthe region overlapping the temperature sensor as viewed from the firstdirection, the temperature sensor is less likely to be influenced byheat generated from each element mounted on the first surface. As aresult, the temperature of the power supply can be detected moreaccurately by the temperature sensor.

(9) The power supply unit for the aerosol inhaler according to any oneof (1) to (8), in which one of the plurality of elements is a DC/DCconverter (first DC/DC converter 63) connected between the power supplyand the load.

The DC/DC converter is mounted on the first surface.

According to (9), since the DC/DC converter is mounted on the firstsurface which is different from the second surface on which thetemperature sensor is mounted, the temperature sensor is less likely tobe influenced by heat generated from the DC/DC converter. As a result,the temperature of the power supply can be detected more accurately bythe temperature sensor.

(10) The power supply unit for the aerosol inhaler according to any oneof (1) to (9), in which one of the plurality of elements is a regulator(LDO regulator 62) configured to convert the power supplied from thepower supply into power for operating the controller.

The regulator is mounted on the first surface.

According to (10), since the regulator is mounted on the first surfacewhich is different from the second surface on which the temperaturesensor is mounted, the temperature sensor is less likely to beinfluenced by heat generated from the regulator. As a result, thetemperature of the power supply can be detected more accurately by thetemperature sensor.

(11) The power supply unit for the aerosol inhaler according to any oneof (1) to (10), in which one of the plurality of elements is a charger(charging IC 55) configured to control the charging of the power supply.

The charger is mounted on the first surface.

According to (11), since the charger is mounted on the first surfacewhich is different from the second surface on which the temperaturesensor is mounted, the temperature sensor is less likely to beinfluenced by heat generated from the charger. As a result, thetemperature of the power supply can be detected more accurately by thetemperature sensor.

(12) The power supply unit for the aerosol inhaler according to any oneof (1) to (11) further includes

an insulating holder (internal holder 13) configured to hold the circuitboard.

The holder includes a partition wall (partition wall 13 d), holds thecircuit board on one side (right side) of the partition wall, and holdsthe power supply on the other side (left side) of the partition wall.

According to (12), the holder holds the circuit board on the one side ofthe partition wall and holds the power supply on the other side of thepartition wall. In this way, since the circuit board and the powersupply are both held by the holder, the temperature sensor can bemaintained at a position suitable for detecting the temperature of thepower supply.

What is claimed is:
 1. A power supply unit for an aerosol inhalercomprising: a power supply configured to supply power to a load thatatomizes an aerosol source; a temperature sensor configured to detect atemperature of the power supply; a controller configured to control atleast one of charging of the power supply and discharging to the loadbased on an output of the temperature sensor; and a circuit board onwhich a plurality of elements including the temperature sensor and thecontroller are mounted, wherein the circuit board includes: a firstsurface; a second surface which is located on a side opposite from thefirst surface; a power supply layer in which a power supply pathconfigured to supply power to the plurality of elements is formed; and aground layer in which a ground path configured to function as a groundof the plurality of elements is formed, the power supply layer and theground layer are provided between the first surface and the secondsurface, the temperature sensor is mounted on the second surface, and atleast one of the power supply path and the ground path is not formed ina region which overlaps the temperature sensor as viewed from a firstdirection, the first direction being a direction in which the firstsurface and the second surface are opposed to each other.
 2. The powersupply unit according to claim 1, wherein the power supply path and theground path are not formed in the region which overlaps the temperaturesensor as viewed from the first direction.
 3. The power supply unitaccording to claim 1, wherein the ground path is not formed in theregion which overlaps the temperature sensor as viewed from the firstdirection, and is formed so as not to surround the temperature sensor.4. The power supply unit according to claim 1, wherein the power supplypath is not formed in the region which overlaps the temperature sensoras viewed from the first direction, and is formed so as not to surroundthe temperature sensor.
 5. The power supply unit according to claim 1,wherein the controller is mounted on the first surface.
 6. The powersupply unit according to claim 1, wherein the temperature sensorincludes a thermistor, one of the plurality of elements is a resistormounted on the second surface, on the second surface, a voltage dividingcircuit is formed by the thermistor and the resistor, and at least oneof the plurality of elements is mounted at a position where a lineardistance from the resistor to the at least one of the plurality ofelements is shorter than a linear distance from the resistor to thethermistor.
 7. The power supply unit according to claim 1, wherein thesecond surface includes a high density region in which mounting densityof the plurality of elements is high, and a low density region in whichthe mounting density of the plurality of elements is lower than that ofthe high density region, and the temperature sensor is mounted in thelow density region.
 8. The power supply unit according to claim 1,wherein the elements are not mounted in the region of the first surfacewhich overlaps the temperature sensor as viewed from the firstdirection.
 9. The power supply unit according to claim 1, wherein one ofthe plurality of elements is a DC/DC converter connected between thepower supply and the load, and the DC/DC converter is mounted on thefirst surface.
 10. The power supply unit according to claim 1, whereinone of the plurality of elements is a regulator configured to convertthe power supplied from the power supply into power for operating thecontroller, and the regulator is mounted on the first surface.
 11. Thepower supply unit according to claim 1, wherein one of the plurality ofelements is a charger configured to control the charging of the powersupply, and the charger is mounted on the first surface.
 12. The powersupply unit according to claim 1, further comprising: an insulatingholder configured to hold the circuit board, wherein the holder includesa partition wall, holds the circuit board on one side of the partitionwall, and holds the power supply on another side of the partition wall.